Graphene electric-conduction glue preparation method
A technology of conductive glue and graphene, which is applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems that the conductive properties of graphene cannot be fully utilized, achieve good conductive effect, strong bonding force, and improve electrical conductivity. performance effect
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Embodiment 1
[0021] The present invention proposes a kind of graphene conductive glue preparation method, comprises the steps:
[0022] S1: Select shadowless glue, acrylate glue, addition type liquid silicone rubber, single-layer graphene, multi-layer graphene, silver paste, nickel powder and flake copper powder as raw materials, and the above raw materials need to be placed separately;
[0023] S2: Put the single-layer graphene and multi-layer graphene in the grinding disperser at the same time, and then grind and disperse them to form the first mixed powder, and the particle diameter of the first mixed powder must be less than 10um;
[0024] S3: Place nickel powder and flake copper powder in different grinders again, and then grind them. The particle diameter of nickel powder and flake copper powder should be controlled at 8-10um;
[0025] S4: Place the first mixed powder formed in S2 and the nickel powder and flake copper powder processed in S3 in the ultrasonic disperser again, and car...
Embodiment 2
[0036] The present invention proposes a kind of graphene conductive glue preparation method, comprises the steps:
[0037] S1: Select shadowless glue, acrylate glue, addition type liquid silicone rubber, single-layer graphene, multi-layer graphene, silver paste, nickel powder and flake copper powder as raw materials, and the above raw materials need to be placed separately;
[0038] S2: Put the single-layer graphene and multi-layer graphene in the grinding disperser at the same time, and then grind and disperse them to form the first mixed powder, and the particle diameter of the first mixed powder must be less than 10um;
[0039] S3: Place nickel powder and flake copper powder in different grinders again, and then grind them. The particle diameter of nickel powder and flake copper powder should be controlled at 8-10um;
[0040] S4: Place the first mixed powder formed in S2 and the nickel powder and flake copper powder processed in S3 in the ultrasonic disperser again, and car...
Embodiment 3
[0051] The present invention proposes a kind of graphene conductive glue preparation method, comprises the steps:
[0052] S1: Select shadowless glue, acrylate glue, addition type liquid silicone rubber, single-layer graphene, multi-layer graphene, silver paste, nickel powder and flake copper powder as raw materials, and the above raw materials need to be placed separately;
[0053] S2: Put the single-layer graphene and multi-layer graphene in the grinding disperser at the same time, and then grind and disperse them to form the first mixed powder, and the particle diameter of the first mixed powder must be less than 10um;
[0054] S3: Place nickel powder and flake copper powder in different grinders again, and then grind them. The particle diameter of nickel powder and flake copper powder should be controlled at 8-10um;
[0055] S4: Place the first mixed powder formed in S2 and the nickel powder and flake copper powder processed in S3 in the ultrasonic disperser again, and car...
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