Array substrate and manufacturing method thereof, and display panel

A technology of an array substrate and a manufacturing method, which is applied in the fields of an array substrate and a manufacturing method thereof and a display panel, can solve the problems of large volume, difficult to realize narrow frame, high power consumption, etc.

Pending Publication Date: 2019-08-16
HKC CORP LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Although the amorphous silicon active switch is widely used in the display field, it is difficult to achieve a narrow frame due to its large size, and its power consumption is also large

Method used

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  • Array substrate and manufacturing method thereof, and display panel
  • Array substrate and manufacturing method thereof, and display panel
  • Array substrate and manufacturing method thereof, and display panel

Examples

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Embodiment Construction

[0050] It should be understood that the terminology and specific structural and functional details disclosed herein are representative only for describing specific embodiments, but the application can be embodied in many alternative forms and should not be construed as merely Be limited by the examples set forth herein.

[0051] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating relative importance, or implicitly indicating the quantity of indicated technical features. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of these features; "plurality" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, possible presence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0052] Al...

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PUM

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Abstract

The invention discloses an array substrate and manufacturing method thereof, and a display panel. The manufacturing method of the array substrate comprises the steps of: forming a first active switchcontaining a crystalline oxide semiconductor at the display region of an array substrate, and forming a second active switch containing a polysilicon semiconductor at the non-display region of the array substrate, wherein the crystalline oxide semiconductor and the polysilicon semiconductor are formed on the same layer. The power consumption of the circuit in the display region is reduced while the narrow frame is achieved; and moreover, after the oxide conductor and an amorphous silicon semiconductor are prepared on the same layer and then are subjected to crystallization process at the sametime so that the manufacture procedure of converting the amorphous silicon to the polycrystalline silicon is not influenced and the stability of the array substrate is increased.

Description

technical field [0001] The present application relates to the field of display technology, in particular to an array substrate, a manufacturing method thereof, and a display panel. Background technique [0002] Whether the display device is a Liquid Crystal Display (LCD for short) or an Organic Light-Emitting Display (OLED for short), an active switch (ThinFilm Transistor, TFT for short) is provided, and the performance of the active switch It greatly affects the performance of the display device. In the display device, the active switch can be set in the display area (that is, the AA area) to control the display of the pixels, or it can be set in the non-display area such as the gate drive circuit (Gate On Array, GOA for short) area as a drive part of the circuit. Active switches can be classified into amorphous silicon active switches, low temperature polysilicon (LTPS) active switches, and oxide semiconductor active switches according to the material of the active layer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77G02F1/1362
CPCH01L27/127H01L27/1229G02F1/136227G02F1/13624
Inventor 卓恩宗雍万飞
Owner HKC CORP LTD
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