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A kind of circuit board preparation method and circuit board

A circuit board and circuit layer technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of heavy metal pollution in wastewater, high consumption, and many processes.

Active Publication Date: 2021-04-20
北京大华博科智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the manufacturing process of etching circuit boards is complex, with many processes, consumes a lot of water and electricity, and also consumes a lot of copper and chemical materials, resulting in a lot of waste water, waste liquid, waste residue and heavy metal pollution.

Method used

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  • A kind of circuit board preparation method and circuit board
  • A kind of circuit board preparation method and circuit board
  • A kind of circuit board preparation method and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] This embodiment provides a method for preparing a circuit board, comprising the following steps:

[0051] (1) Spray insulating ink layer by layer on the entire area of ​​the surface of the carrier substrate, and form the bottom layer after the insulating ink is cured;

[0052] (2) According to the structure of the first circuit layer, spray insulating ink layer by layer on the first region of the bottom surface, and form the insulating part of the first circuit layer after the insulating ink solidifies;

[0053] (3) spray conductive ink layer by layer on the second area of ​​the surface of the bottom layer, and obtain the conductive part of the first circuit layer after the conductive ink is cured;

[0054] The first region surrounds the second region; the insulating region of the first circuit layer is equal in thickness to the conductive region of the first circuit layer.

[0055] In the first example of this embodiment, the conductive portion of the first layer circ...

Embodiment 2

[0093] This embodiment provides a method for preparing a single-layer circuit board, including the following method steps:

[0094] (1) Based on the inkjet printer, UV insulating ink is printed on the surface of the carrier substrate to cover the entire carrier substrate, and the bottom layer is formed after being cured by a UV lamp.

[0095] (2) according to figure 1 The single-layer circuit board layout diagram shown identifies a first area of ​​the bottom surface and a second area, the first area being figure 1 The location of the insulation on a single-layer circuit board is shown. The second area is figure 1 The position of the conductive part of the single-layer circuit board shown is the circuit position of the single-layer circuit board.

[0096] (3) UV insulating ink is ink-jet printed on the first area of ​​the bottom surface, and cured by a UV lamp to form the insulating part of the single-layer circuit board.

[0097] (4) Print the position of the conductive in...

Embodiment 3

[0101] This embodiment provides a method for preparing a double-layer circuit board, including the following method steps:

[0102] (1) Based on the inkjet printer, UV insulating ink is printed on the surface of the carrier substrate to cover the entire carrier substrate, and the bottom layer is formed after being cured by a UV lamp.

[0103] (2) according to image 3 The structure of the bottom circuit layer in the shown double-layer circuit board wiring schematic diagram determines the first area and the second area of ​​the bottom surface, and the first area of ​​the bottom surface is image 3 The location of the insulation on the bottom circuit layer in a two-layer circuit board is shown. The second region of the underlying surface is image 3 The position of the conductive part of the bottom circuit layer in the shown double-layer circuit board is the circuit position of the bottom circuit layer.

[0104] (3) UV insulating ink is ink-jet printed on the first area of ​​...

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Abstract

The embodiment of the present invention relates to a method for preparing a circuit board and the circuit board. The method includes the following steps: (1) spray insulating ink layer by layer on the entire surface of the carrier substrate, and form the bottom layer after the insulating ink is cured; (2) according to the structure of the first circuit layer, the first layer on the surface of the bottom layer The area is sprayed with insulating ink layer by layer, and the insulating part of the first circuit layer is formed after the insulating ink is cured; (3) the conductive ink is sprayed layer by layer on the second area of ​​the bottom surface, and the first circuit layer is obtained after the conductive ink is cured. The conductive part of the circuit layer; the first region surrounds the second region; the insulating region of the first circuit layer is equal in thickness to the conductive region of the first circuit layer.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of circuit boards, in particular to a method for preparing a circuit board and the circuit board. Background technique [0002] Circuit boards are basic components in the electronics industry and are used for electrical signal transmission of components. Almost all electronic devices we can see are inseparable from circuit boards, ranging from electronic watches, calculators, general-purpose computers, televisions, to supercomputers, robots, communication electronic equipment, military weapon systems, etc., as long as there are electronic components such as integrated circuits Components, the electrical interconnection between them all use circuit boards, which provide mechanical support for the fixed assembly of various electronic components such as integrated circuits, and realize the wiring and electrical connections between various electronic components such as integrated circui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/10H05K3/12H05K3/40H05K3/46
CPCH05K3/107H05K3/125H05K3/4038H05K3/4644
Inventor 不公告发明人
Owner 北京大华博科智能科技有限公司