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Direct modulation laser structure

A laser, direct technology, applied in the field of direct modulation laser structure, can solve the problems of affecting the cooling effect of the refrigerator, increasing the thermal resistance of the laser chip and the metal carrier plate, etc., achieving reduced length, reduced equivalent inductance, and good effect Effect

Inactive Publication Date: 2019-08-23
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the above structure, the aluminum nitride circuit substrate between the laser chip and the metal carrier increases the thermal resistance between the laser chip and the metal carrier, thereby affecting the cooling effect of the refrigerator.

Method used

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  • Direct modulation laser structure
  • Direct modulation laser structure
  • Direct modulation laser structure

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with accompanying drawing:

[0026] Such as Figure 1-2 As shown, a directly modulated laser structure includes a semiconductor refrigerator, a metal carrier, a circuit substrate, and a laser chip.

[0027] Mount the metal carrier plate on the peltier cooler.

[0028] Both the circuit substrate and the laser chip are directly installed on the metal carrier, and the laser chip is installed as close to the circuit substrate as possible.

[0029] The circuit substrate is made of ordinary alumina ceramic material. The thickness of the circuit substrate used is the same as the thickness of the laser chip, which is 100 microns, which allows the thickness of the circuit substrate to be close to the thickness of the laser chip. %. The circuit metal layer on the circuit substrate does not need to be grounded, only a microwave transmission line pattern is required, and the circuit substrate does not need to b...

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Abstract

The invention relates to the field of optoelectronic devices, and discloses a direct modulation laser structure. The laser structure comprises a semiconductor refrigerator, a metal support plate, a circuit substrate and a laser chip, wherein the metal support plate is mounted on the semiconductor refrigerator, the laser chip and the circuit substrate are installed on the metal support plate, the thickness of the circuit substrate is the same as or close to that of the laser chip, a transmission line graph formed by a metal layer is arranged on the circuit substrate, and the transmission line graph is connected with a bonding pad on the surface of the laser chip through a bonding alloy wire. Through the scheme, the laser structure improves the microwave signal transmission quality, reducesthe energy consumed by the semiconductor refrigerator, or improves the refrigeration effect; the laser structure reduces the complexity of the circuit substrate, and reduces the product cost.

Description

technical field [0001] The invention relates to the field of optoelectronic devices, in particular to a directly modulated laser structure. Background technique [0002] In the field of optoelectronics, the laser is a basic device. Among them, the direct modulation laser is a device that loads a microwave signal onto the laser and modulates the output optical signal of the laser. [0003] Typical directly modulated lasers often use semiconductor refrigerators for constant temperature control. The specific design is generally to assemble a metal carrier on the semiconductor refrigerator, assemble an aluminum nitride circuit substrate on the metal carrier, install the laser chip on the aluminum nitride substrate, and have a metal circuit layer pattern on the aluminum nitride substrate. It consists of two parts, a transmission line pattern and a grounding pattern, and the grounding part is connected to the metal carrier plate through the metallized grounding through hole on t...

Claims

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Application Information

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IPC IPC(8): H01S5/022H01S5/024H01S5/02
CPCH01S5/0206H01S5/02415H01S5/02345
Inventor 廖翱张童童吕晓萌景飞伍艺龙余昌喜高阳许玮华
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP