Uniform stress criterion-based bonding structure fracture failure analysis method
A failure analysis and bonding technology, applied in special data processing applications, instruments, design optimization/simulation, etc., can solve the problems of uneven stress distribution of the adhesive layer, non-unique stress components, and inaccuracy.
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[0082] First, test the bonding structure under the complex stress state. According to a certain interpolation value, several groups of bonding joint tests with typical tensile-shear ratios are formulated, and each type of bonding joints with different typical tensile-shear ratios is marked. The joint is realized by bonding joints with different embedding angles. The bonded joint consists of two aluminum alloy test bars and a layer of adhesive between them. The joint angle α of the joints with different tension-shear ratios is also different. In order to facilitate the quasi-static tensile test, a through hole is provided on the non-adhesive end of the aluminum alloy test bar to connect it with the cross universal joint of the tensile testing machine through a pin, such as figure 1 Shown. Since there are many factors that affect the adhesive strength of bonded joints, in order to obtain better bonding quality, in addition to the specified environment, a reasonable and complete...
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