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A waveguide to microstrip e-plane probe transition structure with ground loop

A grounding loop and transition structure technology, applied in waveguide-type devices, circuits, connecting devices, etc., can solve the problems that affect the original transition performance, increase the difficulty of circuit design, design difficulties, etc., achieve good practical value, solve grounding difficulties, and structure. simple effect

Active Publication Date: 2020-11-06
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although such a conversion structure has its own grounding loop, the structure is more complicated and the design is more difficult.
[0004] Generally speaking, the traditional grounding method will not only affect the performance of the original transition, but also have a complex structure, which increases the difficulty of circuit design

Method used

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  • A waveguide to microstrip e-plane probe transition structure with ground loop
  • A waveguide to microstrip e-plane probe transition structure with ground loop
  • A waveguide to microstrip e-plane probe transition structure with ground loop

Examples

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Effect test

Embodiment 1

[0025] In this embodiment, the soft substrate Rogers 5880 is selected as the microstrip substrate, and the following is established in the field simulation software HFSS figure 1 Grounded E-plane probe shown. Compared with the traditional E-plane probe, the ground E-plane probe adds a ground wire 10 , a ground pad 9 , a metallized via hole 11 and a waveguide short-circuit surface groove 8 .

[0026] The above-mentioned grounding Pad9 is embedded in the groove 8 of the short-circuit surface of the waveguide, and the metal on the back is pasted with conductive adhesive to achieve DC grounding, and at the same time, it can play the role of fixing the substrate 4 structurally. A metallized via hole 11 is provided on the grounding Pad9, and the metallized via hole 11 is connected to the metal on the lower surface of the substrate 4 to achieve good grounding.

[0027] For the top view of the ground E-plane probe, see figure 2 , the ground wire 10 connects the E-plane probe 7 and ...

Embodiment 2

[0033] In this embodiment, the hard substrate quartz is selected as the microstrip substrate, and the field simulation software HFSS is set up as Figure 4 Grounded E-plane probe shown. Compared with the traditional E-plane probe, the grounded E-plane probe adds a probe branch 12, a bonding gold wire 13 and a waveguide short-circuit surface groove 8. The groove 8 on the short-circuit surface of the waveguide is arranged at the center of the short-circuit surface 3 of the waveguide to facilitate the bonding of gold wires to the cavity.

[0034] For the top view of the ground E-plane probe, see Figure 5 , the probe branch 12 extends to the edge of the substrate 4 along the centerline of the waveguide. The probe branch 12 can not only play a positioning role when the gold wire is bonded, but also shorten the length of the bonding gold wire 13, thereby reducing the sensitivity of the probe performance to changes in the length and crown height of the gold wire. The bonding gold...

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Abstract

The invention discloses a transitional structure from a waveguide with a grounding loop to a microstrip E-plane probe. On the basis of the traditional E-plane probe, the E-plane probe is connected to the The waveguide short-circuit surface realizes the microstrip grounding function while realizing the transition from the waveguide to the microstrip, and solves the problem of difficult grounding of the microstrip circuit in the narrow channel of the millimeter-wave and terahertz frequency bands, and the introduced thin metal wire for grounding is almost It does not affect the transmission performance of the original E-plane probe, so that the new ground E-plane probe does not need to be redesigned; the invention has the advantages of simple structure and convenient processing, which greatly simplifies the design of waveguide to microstrip transition and DC grounding, It has very good practical value in the design of functional circuits such as millimeter wave and terahertz frequency band mixers, frequency multipliers, and wave detectors.

Description

technical field [0001] The invention belongs to the technical field of a conversion structure from a waveguide to a microstrip line in the millimeter wave and terahertz frequency bands, and in particular relates to a transition structure from a waveguide with a ground loop to a microstrip E-plane probe. Background technique [0002] In the millimeter wave and terahertz frequency bands, test equipment and component modules basically use standard waveguides as interfaces and interconnection transmission lines to reduce losses; at the same time, in order to facilitate interconnection with active devices, microstrip lines or suspended microstrip lines Transmission lines are also heavily used. Since the waveguide and the microstrip line support different electromagnetic wave modes and have different characteristic impedances at the same time, it is necessary to realize the conversion of the electromagnetic wave from the waveguide (TE10 mode) to the microstrip (quasi-TEM mode). A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/107
CPCH01P5/107
Inventor 张勇吴成凯蒋巍魏浩淼延波徐锐敏
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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