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Anisotropic insulating thermal-conductive sheet and preparation method thereof

An insulation and heat conduction, anisotropic technology, applied in heat exchange materials, chemical instruments and methods, flat products, etc., can solve problems such as non-insulation of products, breakdown of circuit boards, etc., and achieve excellent insulation performance and good thermal conductivity. Effect

Pending Publication Date: 2019-09-13
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there are some thermally conductive sheets on the market that use carbon fiber orientation to obtain ultra-high thermal conductivity. However, due to the good electrical conductivity of carbon fiber itself, the product is not insulated, and the related circuit board will be accompanied by the risk of voltage breakdown during application.

Method used

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  • Anisotropic insulating thermal-conductive sheet and preparation method thereof
  • Anisotropic insulating thermal-conductive sheet and preparation method thereof

Examples

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preparation example Construction

[0045] A method for preparing an anisotropic insulating and thermally conductive sheet, comprising

[0046] Steps for preparing thermally conductive preparatory material: uniformly mixing carbon fiber, spherical micropowder and flame retardant in flexible polymer material to prepare thermally conductive preparatory material;

[0047] Flow rate shear orientation step: extruding the above thermally conductive preparatory material through an extruder to orient the carbon fibers in the direction of flow rate, and heating and curing in a movable mold groove that can be closed to form a molded body;

[0048] Ultrasonic cutting step: using ultrasonic cutting to cut the molded body along the direction perpendicular to the flow velocity to obtain a thermally conductive sheet with carbon fibers oriented along the thickness direction.

[0049] In a further solution, the preparation method of the present invention also includes a step of surface treatment of the thermally conductive sheet...

Embodiment 1

[0062] An anisotropic insulating and thermally conductive sheet, comprising a thermally conductive sheet, the surface of the thermally conductive sheet is coated with a polymer coating to form a polymer coating, and the raw materials for preparing the anisotropic insulating and thermally conductive sheet include at least flexible high Molecular material, carbon fiber, spherical fine powder and flame retardant, the carbon fiber is oriented in the thickness direction of the thermally conductive sheet;

[0063] Its preparation method is as follows:

[0064] The steps of preparing thermal conductivity preparation materials: 15 parts by weight of methyl vinyl silicone rubber, 100 parts by weight of vinyl silicone oil with a viscosity of 800mpa.s, 80 parts by weight of dimethyl silicone oil, 3 parts by weight of H-containing silicone oil, 1 Parts by weight of platinum water catalyst, 1200 parts by weight of spherical micropowder, 150 parts by weight of aluminum hydroxide, and 500 pa...

Embodiment 2

[0069] An anisotropic insulating and thermally conductive sheet, comprising a thermally conductive sheet, the surface of the thermally conductive sheet is coated with a polymer coating to form a polymer coating, and the raw materials for preparing the anisotropic insulating and thermally conductive sheet include at least flexible high Molecular material, carbon fiber, spherical fine powder and flame retardant, the carbon fiber is oriented in the thickness direction of the thermally conductive sheet;

[0070] Its preparation method is as follows:

[0071] The steps of preparing thermal conductivity preparatory material: 15 parts by weight of methyl vinyl silicone rubber, 150 parts by weight of vinyl silicone oil with a viscosity of 100000mpa.s, 120 parts by weight of dimethyl silicone oil, 0.08 parts by weight of retardation inhibitor, 4.0 parts by weight Parts by weight of H-containing silicone oil, 3 parts by weight of platinum water catalyst, 1200 parts by weight of spherica...

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Abstract

The invention discloses an anisotropic insulating thermal-conductive sheet. The anisotropic insulating thermal-conductive sheet comprises a thermal-conductive sheet, and raw materials for preparing the anisotropic insulating thermal-conductive sheet comprise at least a flexible polymer material, carbon fibers, spherical micropowder and a flame retardant, wherein the carbon fibers are oriented in the thickness direction of the thermal-conductive sheet. The invention also discloses a preparation method of the anisotropic insulating thermal-conductive sheet. The anisotropic insulating thermal-conductive sheet provided by the invention comprises at least the flexible polymer material, the carbon fibers, the spherical micropowder and the flame retardant, so that a random thermal-conductive filler is mixed in the thermosetting flexible polymer material, and the fibrous thermal-conductive filler is oriented in the flow direction by utilizing the action of shearing force; and the anisotropic insulating thermal-conductive sheet is a thermal-conductive sheet having excellent thermal conductivity and insulation properties.

Description

technical field [0001] The invention relates to the technical field of thermally conductive interface materials and their preparation, in particular to an insulating thermally conductive material and a preparation method thereof. Background technique [0002] With the rapid development of data networks, electronic and electrical products are developing toward intelligence, high speed, and complexity, and the density of integrated circuits will approach the physical limit, which will lead to more and more heat generated by product equipment during operation. The inability to transfer and disperse by express delivery affects the stability and service life of electronic products. Therefore, thermal issues have become the primary problem to be solved in the development of electronic products. [0003] In order to dissipate heat efficiently, thermal interface materials are filled between semiconductor chips, radiators, and cooling fans. Conventional thermal conductive materials o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C08L83/04C08L83/07C08L83/05C08K7/18C08K7/06C08K3/22C09K5/14B29C48/07B29C48/25B29C48/70B29L7/00
CPCC08L83/04C09K5/14B29C48/07B29C48/25B29C48/70B29C48/0022C08K2003/2227C08J2383/07C08J2483/07B29L2007/00C08J7/0427C08K7/18C08K7/06C08K3/22
Inventor 羊尚强陈印谢佑南曹勇
Owner SHENZHEN HFC SHIELDING PRODS CO LTD