Temperature equalizing plate and manufacturing method thereof

A manufacturing method and technology of a temperature equalizing plate, which are applied in the structural parts of electrical equipment, cooling/ventilation/heating renovation, electrical components, etc. Heat dissipation efficiency, the effect of avoiding oxidation and pollution

Pending Publication Date: 2019-09-17
AURAS ELECTRONICS SCI & TECH IND KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, since the structure of the vapor chamber only has a single access hole (i.e., a liquid injection hole), the gas can only enter and exit the chamber through the single access hole, so when the upper plate body and the lower plate body are combined by brazing During the process, the gas circulation will not be smooth, resulting in a high proportion of the oxyge

Method used

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  • Temperature equalizing plate and manufacturing method thereof
  • Temperature equalizing plate and manufacturing method thereof
  • Temperature equalizing plate and manufacturing method thereof

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[0042] For the convenience of description, the various structures, tissues or components of the temperature equalizing plate in the drawings of the present invention are not based on their application ratios, but need to be enlarged in different proportions according to the description, but it is not used to limit the implementation of the temperature equalizing plate of the present invention.

[0043] See Figure 1 ~ Figure 3 , figure 1 It is a schematic diagram of the appearance structure of the uniform temperature plate in a first preferred embodiment of the present invention, figure 2 for figure 1 The partial structure diagram of the uniform temperature plate shown, image 3 for figure 1 The schematic top view of the partial structure of the temperature equalizing plate shown. For clarity, figure 2 versus image 3 The upper board body and other components are not drawn in. The uniform temperature plate 1 includes an upper plate body 121 and a lower plate body 122, which tog...

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Abstract

The invention provides a temperature equalizing plate and a manufacturing method thereof. The temperature equalizing plate comprises an upper plate body, a lower plate body, a liquid injection hole and a through hole, wherein the upper plate body and the lower plate body jointly form a chamber, an external gas such as a shielding gas can enter the chamber from one of the liquid injection hole and the through hole, an internal gas such as a volatile gas or oxygen can leave the chamber from the other of the liquid injection hole and the through hole so that oxidation and pollution in the chamber can be avoided, and the sufficient external gas can be guaranteed to be injected into the chamber. In addition, the through hole is closed after the upper plate body and the lower plate body are combined, and the liquid injection hole is closed after a working medium fills the chamber.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a uniform temperature plate and a manufacturing method thereof. Background technique [0002] Vapor chamber is a heat dissipation device. Its working principle is similar to that of heat pipe. The difference is that the heat conduction of heat pipe is the transfer of heat in one-dimensional direction, while that of vapor chamber is the transfer of heat in two-dimensional direction. In terms of structure, the vapor chamber is mainly composed of an upper plate body, a lower plate body and a chamber. After the lower plate body contacts a heat source such as a heat-generating electronic component, the working medium in the chamber will change from a liquid state to a gaseous state. The heat is transmitted in the direction of the upper plate, and finally the heat energy is transferred out through the area of ​​the vapor chamber except for the contact with the heat source or the heat dissip...

Claims

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Application Information

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IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/0283F28D15/046H05K7/20336
Inventor 吴安智陈志伟张天曜郭哲玮
Owner AURAS ELECTRONICS SCI & TECH IND KUNSHAN
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