Temperature equalizing plate and manufacturing method thereof

Abstract

The invention provides a temperature equalizing plate and a manufacturing method thereof. The temperature equalizing plate comprises an upper plate body, a lower plate body, a liquid injection hole and a through hole, wherein the upper plate body and the lower plate body jointly form a chamber, an external gas such as a shielding gas can enter the chamber from one of the liquid injection hole and the through hole, an internal gas such as a volatile gas or oxygen can leave the chamber from the other of the liquid injection hole and the through hole so that oxidation and pollution in the chamber can be avoided, and the sufficient external gas can be guaranteed to be injected into the chamber. In addition, the through hole is closed after the upper plate body and the lower plate body are combined, and the liquid injection hole is closed after a working medium fills the chamber.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a uniform temperature plate and a manufacturing method thereof. Background technique [0002] Vapor chamber is a heat dissipation device. Its working principle is similar to that of heat pipe. The difference is that the heat conduction of heat pipe is the transfer of heat in one-dimensional direction, while that of vapor chamber is the transfer of heat in two-dimensional direction. In terms of structure, the vapor chamber is mainly composed of an upper plate body, a lower plate body and a chamber. After the lower plate body contacts a heat source such as a heat-generating electronic component, the working medium in the chamber will change from a liquid state to a gaseous state. The heat is transmitted in the direction of the upper plate, and finally the heat energy is transferred out through the area of ​​the vapor chamber except for the contact with the heat source or the heat dissip...

AI Technical Summary

Problems solved by technology

[0005] However, since the structure of the vapor chamber only has a single access hole (i.e., a liquid injection hole), the gas can only enter and exit the chamber through the single access hole, so when the upper plate body and the lower plate body are combined by brazing During the process, the gas circulation will not be smooth, resulting in a high proportion of the oxygen in the chamber and the volatile gas generated by the heating of the solder in the chamber to remain in the chamber, resulting in oxidation and pollution of the working environment in the chamber. At the same time, it can The shielding gas injected into the chamber is also quite limited, which will greatly affect the overall heat dissipation performance of the vapor chamber

Images