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Scraper device, solder paste printing machine and manufacturing method of circuit board

A solder paste printing machine and printed circuit board technology, which is applied in the direction of assembling printed circuits with electrical components, printing machines, rotary printing machines, etc., can solve problems such as the decline in chip production efficiency, fast chip placement, and affecting chip placement efficiency , to achieve the effect of improving efficiency, avoiding patch operation, and speeding up the production process

Inactive Publication Date: 2019-09-20
OPPO CHONGQING INTELLIGENT TECH CO LTD
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Problems solved by technology

[0003] However, since the size of the panel is reduced, the number of single boards becomes smaller, and the points on the panel that need to be placed become smaller, so the speed of placement is very fast. During the entire placement process, solder paste printing becomes an influence on placement. The bottleneck of chip efficiency, the board output speed of the printing machine cannot supply the subsequent chip mounter, the entire chip mount line is in the state of waiting for boards or transferring boards, and the production efficiency of chip placement has dropped significantly

Method used

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  • Scraper device, solder paste printing machine and manufacturing method of circuit board
  • Scraper device, solder paste printing machine and manufacturing method of circuit board
  • Scraper device, solder paste printing machine and manufacturing method of circuit board

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Embodiment Construction

[0019] SMT (Surface Mounting Technology, surface mount technology), also known as surface mount or surface mount technology, is currently the most popular technology and process in the electronics assembly industry. It is a surface mount component (referred to as SMC / SMD, Chinese called chip component) packaged in a matrix arrangement without leads or short leads or balls, mounted on the surface of a printed circuit board (PCB) or On the surface of other substrates, the circuit assembly technology is soldered and assembled by methods such as reflow soldering or dip soldering.

[0020] refer to figure 1 , figure 1 It is the first flow diagram of the SMT process provided by the embodiment of the present application. The SMT process mainly includes a board loading machine, a printing machine, SPI (solder paste inspection, solder paste inspection), a placement machine, and AOI (Automated Optical Inspection, automatic optical inspection) , Six processes of reflow furnace.

[002...

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Abstract

The invention discloses a scraper device, a solder paste printing machine and a manufacturing method of a circuit board. The scraper device comprises a fixing assembly, and a scraper assembly which consists of a fixing part and a blade part, wherein the fixing part is connected to the fixing assembly to fix the scraper assembly through the fixing assembly; the blade part is connected to the fixing part; the length of the blade part is less than that of the fixing part, and thus only the circuit board, to be printed, of a plurality of circuit boards corresponding to the scraper assembly can be subjected to solder paste scraping while the scraper device is operated to scrap the solder paste. According to the scraper device adopting the abovementioned mode, one circuit board in double splicing boards can be subjected to solder paste scraping without influencing another circuit board, and the solder paste scraping efficiency can be improved.

Description

technical field [0001] The present application relates to the technical field of circuit board production, in particular to a scraper device, a solder paste printing machine and a circuit board production method. Background technique [0002] As the components of electronic products become more and more precise, the pin spacing on the circuit boards (such as printed circuit boards or flexible circuit boards) is getting smaller and smaller, and the accuracy of solder paste printing is getting higher and higher. The requirements for material expansion and contraction tolerance (expansion and contraction tolerance: the difference between the actual size produced by the board factory and the design standard size) are becoming more and more stringent. Now, the tolerance value of the expansion and contraction of the entire board is generally controlled by reducing the size of the panel. The smaller the panel, the smaller the corresponding expansion and contraction value after the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F15/46H05K3/34
CPCB41F15/46B41P2200/40B41P2215/10H05K3/34
Inventor 梁大定
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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