Power-consumption-free heat dissipation device of electronic device

Abstract

The invention discloses a power-consumption-free heat dissipation device of an electronic device. The power-consumption-free heat dissipation device comprises a body, wherein the body comprises a shell and a filling body. The shell wraps the filling body, the shell is made of a solid heat conduction material, and the filling body is made of a phase change material. A first air hole and a second air hole which are communicated are formed in the body, the first air hole transversely extends and forms an opening in the side face of the body, and the second air hole extends upwards and forms an opening in the upper end of the body. The power-consumption-free heat dissipation device is mounted on the electronic device. The phase-change process of the phase-change material and the first air hole and the second air hole are utilized to form a chimney effect, so that the heat dissipation of the electronic device can be conveniently and efficiently realized. The defect that a traditional radiator is subjected to high-power operation in a short time of an electronic device and generates a large amount of heat which cannot be discharged in time is overcome, so that a role in protecting the electronic device is played. Meanwhile, an external power supply does not need to be externally connected, and no noise is generated in the working process, and the heat dissipation device is compact in structure and is stable and durable. The heat dissipation device is used in the field of heat dissipation devices.

Description

technical field [0001] The invention relates to the field of heat dissipation devices, in particular to a heat dissipation device for electronic devices without power consumption. Background technique [0002] People widely use electronic equipment in daily life, but high-power electronic components such as the central processing unit of computers, north bridge chips, and graphics cards in electronic equipment will generate a lot of heat during operation. If the heat cannot be dissipated effectively, it will It directly causes the temperature of its electronic components to rise sharply, which seriously affects the normal operation of electronic components, and may even cause damage to electronic components. For this reason, it is necessary to install a cooling device in the electronic equipment to dissipate heat from these electronic components, so as to ensure the normal operation of the electronic equipment. Among them, the central processing unit (CPU) chip is the core ...

AI Technical Summary

Problems solved by technology

At present, air-cooled radiators are the most common type of radiators for electronic devices, but traditional air-cooled radiators have disadvantages such as high noise, large volume, and high power consumption, which have relatively large limitations and are difficult to meet market demand.

The heat dissipation effect of the water-cooled radiator is relatively stable, but the overall price is high, and the installation and disassembly are complicated. When the usage rate of electronic devices is high, it is difficult for the liquid circulation to quickly remove a large amount of heat.

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