Manufacturing method of high-conductivity transparent glass-based circuit board capable of serving as building material

Abstract

The invention discloses a manufacturing method of a high-conductivity transparent glass-based circuit board capable of serving as a building material. The manufacturing method comprises the steps: substrate selection, conductive medium manufacturing, conductive medium printing, circuit detection, tempering and finished circuit detection. According to the invention, the silver paste with high conductivity is used as a conductive medium, the glass which is not toughened is used as a substrate, the glass can be toughened by adopting a general glass toughening process, and the silver paste is sintered on the glass while being toughened, so that the flatness, stress and the like of the glass can be ensured to meet the requirements of building glass. Secondly, the silver paste with high conductivity is used as the conductive medium, and silver molecules and glass molecules mutually penetrate, so that the adhesive force of the conductive medium on the surface of the glass is increased, and the conductivity of the circuit board substrate is improved. Meanwhile, the conductive medium is printed on the air layer surface of the glass substrate through the silk-screen printing technology, the diameter and thickness of the circuit can be changed through the change of a screen plate, thereby reducing the consumption of silver paste, and facilitating the popularization and application of the glass-based circuit board in various industries.

Description

technical field [0001] The invention relates to the field of electronic imaging device production and the field of construction, in particular to a method for producing a high-conductivity transparent glass-based circuit board that can be used as a building material, and in particular to the production of a safety glass-based circuit board for construction. Background technique [0002] With the rapid development of electronic technology, electronic technology has been widely used in all walks of life. Among them, in daily life, it is often necessary to display some information such as advertisements and news to the public through imaging devices, so that people can quickly grasp relevant information. [0003] In public places such as buildings, high-speed rail, and airports, it is often used to stick light-emitting chips, LEDs and other light-emitting bodies on tempered glass through adhesives, and then connect each light-emitting body together through wires. The role of th...

AI Technical Summary

Problems solved by technology

The standard clearly states that the furnace temperature should be avoided to exceed 320°C during the entire secondary heat treatment process of glass. If the glass surface temperature exceeds 300°C, the tempering stress of the glass will relax due to overheating, causing the glass to burst or bend, thereby affecting its safety and security. Flatness, resulting in a large refractive index of the glass and unclear imaging

This technical method puts tempered glass in a high-temperature environment for a long time for a second time, which obviously does not meet the building material grade standard and has potential safety hazards. Therefore, the products of this method cannot be used in areas that require safety at all, and it is difficult to meet the use in public places.

Images