A kind of ceramic plate production process
A production process and ceramic board technology, which is applied in the field of ceramic board production technology, can solve problems affecting the health of production personnel, easily damaged PCB ceramic boards, and PCB ceramic boards are fragile, so as to achieve convenient and quick access, improve quality, reduce The effect of small contact area
Active Publication Date: 2020-09-08
福建省德化戴玉堂陶瓷有限公司
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Problems solved by technology
[0003] However, the PCB ceramic board is fragile. After bonding the copper foil on the PCB ceramic board, the circuit board needs to be inspected to check the integrity of the circuit board, and the dust on the PCB ceramic board needs to be cleaned. When placed on the workbench for detection , due to the thin thickness of the PCB ceramic board, it is not easy to take it. When the PCB ceramic board is tested, the uneven force is easy to damage the PCB ceramic board, and the air pipe is used to clean the dust on the ceramic board, so that waste and dust gather indoors. Debris and dust can re-accumulate on cleaned ceramic plates and affect the health of production personnel
Method used
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[0024] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0025] Such as Figure 1-Figure 5 Shown, a kind of ceramic plate production technique of the present invention, this technique comprises the following steps:
[0026] S1: Mix pure alumina powder, SiO2, MgO, and CaO powder through a stirring and mixing device, then continue to add toluene and ethyl cellulose, and stir to obtain a mixture; grind the obtained mixture through a grinder, After the mixture is ground to a viscosity, the mixture is taken out to obtain a viscous ceramic slurry. After grinding and stirring, the raw materials in the mixture can be mixed more evenly to prevent the uneven distribution of the raw materials in the ceramic plate after production. The production of ceramic plates is unqualified, and at the same time, the powdery ...
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The invention relates to the field of ceramic printed circuit boards (PCBs), in particular to a ceramic board production process. A used ceramic board production device comprises a support frame, a sealing structure, a collecting case, a storage structure, an electromagnetic valve, an air inlet pipe and scrap collecting structure; one end of the electromagnetic valve is fixed to the collecting case and is in conduction with the scrap collecting structure; the other end of the electromagnetic valve is fixed to the air inlet pipe, and furthermore, gas in the scrap collecting structure is controlled by the electromagnetic valve to be connected and disconnected; when the air inlet pipe and the scrap collecting structure are in conduction, the scrap collecting structure is vacuumized inside, so that dust on a ceramic PCB and the storage structure enters into the scrap collecting structure; when the scrap collecting structure is vacuumized inside, contact area between the ceramic PCB and the storage structure is reduced, so that the effect of cleaning scraps and the dust is better; and a filter screen is deformable, so that the filter screen is further effectively protected from blockage, and the scrap collecting quality is further greatly improved.
Description
technical field [0001] The invention relates to the field of PCB ceramic boards, in particular to a ceramic board production process. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation properties and high Thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. Therefore, ceramic substrates have become a high-power power electronic circuit structure technology and basic materials for interconnection technologies. [0003] However, the PCB ceramic board is fragile. After bonding the copper foil on the PCB ceramic board, the circuit board needs to be inspected to check the integrity of the circuit board, and the dust on the PC...
Claims
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IPC IPC(8): B28B11/00B28B17/04C04B35/10C04B35/622
CPCB28B11/005B28B17/04C04B35/10C04B35/622C04B2235/3206C04B2235/3208C04B2235/3418C04B2235/656
Inventor 刘法亭范浩陈路阳
Owner 福建省德化戴玉堂陶瓷有限公司