Composite temperature equalization plate and manufacturing method thereof

Abstract

The invention provides a composite temperature equalization plate and a manufacturing method thereof. The composite temperature equalization plate has the characteristics of being high in machining efficiency, low in cost, free of pollution and small in thickness; and in addition, an additional casing pipe does not need to be additionally arranged, operation is easy, and the good capillary conductivity is achieved. The composite temperature equalization plate comprises a first cover plate, a second cover plate and a containing cavity; a supporting structure and a powder sintered capillary structure are arranged in the containing cavity; a groove is formed in the covering plate surface of the first cover plate to form the containing cavity; the supporting structure comprises convex hulls which are integrally formed with the first cover plate through sheet metal punching, and the height of the convex hulls is smaller than the depth of the groove; the powder sintered capillary structure is closely attached to the covering plate surface of the second cover plate; a mesh capillary structure is arranged between the convex hulls and the powder sintered capillary structure; the first cover plate and the second cover plate are each provided with an extending portion extending outwards from the side edge, the extending portion of the first cover plate is provided with a liquid injection groove channel communicating with the containing cavity, and an air exhausting and liquid injecting port is arranged in the extending portion of the second cover plate and communicates with the liquid injection groove channel and the containing cavity; and the thickness of the temperature equalization plate is between 0.3 mm and 50 mm.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a composite temperature chamber and a manufacturing method thereof. Background technique [0002] With the improvement of people's living standards, the functions and appearance of computers, tablet computers, and mobile phones are constantly upgraded, and the requirements for power consumption and light and thin experience are also increasing. Using heat pipes or vapor chambers, both of which are the same, use the internal setting of the working fluid and change the two-phase flow to perform rapid heat conduction work, and the vapor chamber has good 2D surface heat conductivity and is lightweight. Vapor chambers have gradually replaced heat pipes for heat dissipation. [0003] However, there are still some deficiencies in the production and use of vapor chambers: [0004] (1) The cover plate in the vapor chamber structure generally adopts CNC or etching processing sup...

AI Technical Summary

Problems solved by technology

[0004] (1) The cover plate in the vapor chamber structure generally adopts CNC or etching processing support structure, but this processing has low efficiency, high cost and large pollution;

[0005] (2) The support structure of the cover plate adopts CNC or etching processing, which cannot be really light and thin under the condition of ensuring the machinability and strength;

[0006] (3) The air extraction and liquid injection port on the cover plate in the chamber structure needs to add an additional sleeve for external connection operation, and then after the air extraction and liquid injection is completed, a complicated (pressing + welding) sealing operation is required , more cumbersome;

[0007] (4) The powder sintered structure inside the vapor chamber will break when subjected to external bending, which will greatly affect the capillary conduction capacity

Images