Fan-out module high-voltage packaging process, structure and device

Abstract

The invention discloses a fan-out module high-voltage packaging process, structure and device. The high-voltage packaging process comprises the following steps: tiling a temporary bonding layer on the top surface of a base platform in the stacking direction of a packaging body, placing a plurality of modules at intervals on the top surface of the temporary bonding layer, performing injection molding from the top of the module to form an injection molding layer surrounding the module, and enabling the bottom surface of the injection molding layer to be bonded with the temporary bonding layer; evenly applying high-pressure gas to the top face of an uncured injection molding layer in the direction towards the bottom or performing even pressurization through a pressing plate. Pressure is applied to the top surface of the uncured injection molding layer, for example, the pressure is uniformly applied through high-pressure gas or a pressing plate, so that the molten injection molding material flows to a gap and a low-stress area under the assistance of pressurization, the overall distribution in the injection molding layer is uniform, and the warping and internal stress caused by the difference of a local structure and a thermal expansion coefficient are effectively avoided.

Description

technical field [0001] The present invention relates to the field of packaging technology, and more specifically, to a fan-out module high-voltage packaging process, a fan-out module high-voltage packaging structure, and a fan-out module high-voltage packaging equipment. Background technique [0002] With the trend of miniaturization and integration of electronic products, the high density of microelectronic packaging technology has gradually become the mainstream in the new generation of electronic products. In order to adapt to the development of the new generation of electronic products, especially the development of mobile phones, notebooks and other products, modules are developing in the direction of higher density, faster speed, smaller size and lower cost. The emergence of Fan-out Panel Level Package (FOPLP), as an upgraded technology of Fan-out Wafer Level Package (FOWLP), has a broader development prospect. Compared with traditional wire-bonded modules, fan-out pa...

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Problems solved by technology

[0005] In view of this, the first purpose of the present invention is to provide a fan-out module high-voltage packaging process, which can effectively solve the problem of warping in the chip packaging process. The second aspect of the present invention The first purpose is to provide a fan-out module high-voltage packaging structure, and the third purpose of the present invention is to provide a fan-out module high-voltage packaging equipment

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