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Intelligent module and third-party product butt joint method

A technology of intelligent modules and products, applied in the direction of electrical components, transmission systems, etc., can solve the problems of cumbersome docking process, workload, and non-transparency of docking work, so as to achieve humanization in interaction, more interaction, and complementary advantages Effect

Inactive Publication Date: 2019-09-27
NANJING OHOSURE INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the docking process of this product is relatively cumbersome
Different manufacturers will use modules or products that are directly implanted into each other for design and development, and the docking work cannot be transparent
Most manufacturers do not have interfaces that can be directly connected to achieve, which brings a huge workload to the research and development of both parties

Method used

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  • Intelligent module and third-party product butt joint method
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  • Intelligent module and third-party product butt joint method

Examples

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Embodiment Construction

[0034] In embodiment 1, the products of manufacturers A and B are relatively mature electronic products with an internal MCU, such as figure 2 As shown, the output product of manufacturer B is directly implanted in the reserved unit P4 on the intelligent module P3, and then connected to the input product of manufacturer A through the external interface unit P1 of the intelligent module P3.

[0035] Such as Figure 5 As shown, an intelligent module P3 includes an external interface unit P1, an interface conversion unit P2 and a reserved unit P4;

[0036] External interface unit P1, including UART, SPI, and I2C interfaces;

[0037] Interface conversion unit P2, used for docking, correspondingly connected with UART, SPI, I2C interface, including protocol converter Z;

[0038] The reserved unit P4 is a part of the space on the intelligent module P3 during implantation, which is used to implant products from different manufacturers, and this part should be reserved for docking i...

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Abstract

The invention discloses an intelligent module and third-party product butt joint method. An external interface unit, an interface conversion unit and a reservation unit are included. The external interface unit comprises a UART (Universal Asynchronous Receiver / Transmitter), an SPI (Serial Peripheral Interface) and an I2C (Inter-Integrated Circuit) interface, and a power supply can be externally connected or directly led from a third-party product; the interface conversion unit is correspondingly connected with the UART interface, the SPI interface and the I2C interface; the protocol converter comprises an input interface and an output interface which are used for being in butt joint with a third-party product, an MCU which is used for analyzing the protocol communication content of the input interface and outputting a communication protocol which is in butt joint with a relative manufacturer through the output interface, and a power supply circuit which provides a power supply for the MCU to work and is power supply conversion. The reservation unit is used for implanting a third-party product, and meanwhile an interface for butt joint needs to be reserved in the part. Through the intermediate module method provided by the invention, the advantage complementation among the third-party products is solved, a butt-joint friendly bridge is provided for development, the operation is simple and quick, and the interaction is more humanized.

Description

technical field [0001] The invention relates to technical fields such as wireless and wired communication, and belongs to the smart home industry. Background technique [0002] Today, with the rapid development of information technology, the smart home industry has applied relatively mature electronic products with internal MCUs. These products could not be interconnected originally, but under the development of the new era, it is the future development trend to have RS232 serial communication interface, and then the interconnection of electronic products with communication function. [0003] At present, the docking process of this product is relatively cumbersome. Different manufacturers will use modules or products that are directly implanted into each other for design and development, and the docking work cannot be transparent. Most manufacturers do not have interfaces that can be directly connected to realize it, which brings a huge workload to the research and develop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L29/06
CPCH04L69/08H04L69/22
Inventor 钟立松董新
Owner NANJING OHOSURE INTELLIGENT TECH CO LTD
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