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Method and system for measuring elastic modulus and density of materials based on three-dimensional structure

A material elastic modulus and three-dimensional structure technology, applied in the field of materials, can solve problems such as large equipment volume, simple harmonic excitation force applied to samples, and numerous components

Active Publication Date: 2020-04-21
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] For polymer materials with low elastic modulus, the relationship between stress and strain cannot be obtained through static test methods, and the simple harmonic excitation force cannot be directly applied to the sample externally, and ultrasonic testing equipment cannot be used to test the sample. direct measurement
Moreover, the existing measuring device has a complex structure, a large number of components, and a large volume of equipment.

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  • Method and system for measuring elastic modulus and density of materials based on three-dimensional structure

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Embodiment Construction

[0058] Exemplary embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are only used to teach those skilled in the art how to implement the present invention, but are not intended to exhaust all possible ways of the present invention, nor are they intended to limit the scope of the present invention.

[0059] The present disclosure provides a measurement system and method for measuring elastic modulus and density of a material based on a three-dimensional structure.

[0060] refer to Figure 1a , Figure 1b and Figure 2 to Figure 4 , In this specific embodiment, the measurement system includes a base 1 (may be made of glass material, silicon material, etc.), a vibrating body and a magnet, and the vibrating body includes a reference vibrating body 2 and a vibrating body to be measured. The vibrating body to be tested is the same as the reference vibrating body 2 in all re...

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Abstract

The invention provides a three-dimensional structure-based material elasticity modulus and density measurement system and measurement method. A reference vibrating body and a to-be-measured vibratingbody are mounted on a base and vibrate relative to the base; the to-be-measured vibrating body and the reference vibrating body comprise the same vibrating framework and the same sensor; the to-be-measured vibrating body is further provided with a to-be-measured material film; the vibrating framework can be excited to form at least two vibration modes under the action of exciting force; and the sensor measures the deformation of the reference vibrating body and the to-be-measured vibrating body under at least two vibration modes, and the resonance frequency of the reference vibrating body andthe to-be-measured vibrating body is obtained according to the measurement result of the sensor. The multi-direction and multi-mode vibration characteristics of the three-dimensional structure and thesensor measurement technology are combined, and the elasticity modulus and the density of the to-be-measured material can be obtained in a backstepping mode according to the change of the frequency after the three-dimensional structure is combined with the to-be-measured material film, and the sensor is symmetrically arranged so as to verify whether the excited vibration mode meets the requirements or not.

Description

technical field [0001] The invention relates to the field of material technology, and in particular to a method and system for measuring elastic modulus and density of materials based on three-dimensional structures. Background technique [0002] In the fields of flexible electronics and life sciences, the elastic modulus and density of polymer materials (such as polydimethylsilane, various types of silicone rubber, polyimide films, etc.) often determine the performance of flexible electronic devices and the How to accurately obtain the elastic modulus and density of polymer materials is crucial to the design and development of related flexible electronic devices. [0003] In the traditional detection of elastic modulus and density of materials, some patent applications have been used to measure the modulus of engineering materials by static test methods such as bending deflection, and some patent applications have measured the elastic modulus value by testing the propagatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/32G01N9/00G01N3/02
CPCG01N3/02G01N3/32G01N9/002G01N2009/004
Inventor 冯雪李海波马寅佶
Owner TSINGHUA UNIV