A method for plugging conductive resin in blind holes of conductive substrate

Abstract

The invention relates to a method for plugging conductive resin in blind holes of a conductive substrate. In the invention, the blind holes are plugged for the first time with the aluminum flake mesh, and the conductive resin ink is prebaked, and then the blind holes are plugged with the conductive resin ink for the second time by using the blocking screen. Because the aperture of the aluminum sheet mesh of the plug hole is smaller than that of the blind hole for the first time, the amount of conductive resin ink entering the blind hole is small and enters as a whole, and air bubbles are not easy to exist in the blind hole; Dot screen printing plug conductive resin ink, not only can fill the resin in the blind hole, but at the same time, there will be no large amount of resin accumulation on the copper foil layer on the line surface, making the surface smoother.

Description

technical field [0001] The invention relates to a production process of a conductive plate, more specifically a method for plugging conductive resin in blind holes of a conductive substrate. Background technique [0002] Aluminum-based printed circuit boards have the characteristics of good thermal conductivity, low cost, and easy processing, but at the same time there is the problem of difficult conduction between the circuit layer and the aluminum base. The usual practice is to drill a blind hole between the circuit layer and the aluminum base, and then fill the blind hole with conductive resin ink to realize the conduction between the circuit layer and the aluminum base. The total thickness of the copper foil and insulating layer of the circuit layer of the aluminum substrate is in the range of 0.08-0.15mm, and the depth of the blind hole is between 0.2-0.4mm. Usually, an aluminum mesh with a larger aperture than the blind hole is used to directly screen the conductive re...

AI Technical Summary

Problems solved by technology

In this method, because the oil hole under the resin on the aluminum sheet is larger than the blind hole, the conductive resin is completely covered on the blind hole during silk printing, and a large amount of air in the blind hole will be sealed in the blind hole to form air bubbles, which cannot be completely discharged after standing and pre-baking. , leading to conductive resin ink voids in the blind holes, which increases the on-resistance between the circuit layer and the aluminum base, and ultimately affects the use of the product

Images