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Manipulator transmission mechanism, transmission chamber and semiconductor processing equipment

A transmission mechanism and manipulator technology, which is applied in semiconductor/solid-state device manufacturing, conveyor objects, transportation and packaging, etc., can solve the problems of complex conveying process, complex structure, and long time for transferring wafers, so as to improve the efficiency of wafer transfer, Simple structure, easy to manufacture and install

Active Publication Date: 2021-12-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the structure of the current manipulator transmission mechanism is relatively complicated, and the transfer process is more complicated, resulting in a longer time for transferring wafers

Method used

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  • Manipulator transmission mechanism, transmission chamber and semiconductor processing equipment
  • Manipulator transmission mechanism, transmission chamber and semiconductor processing equipment
  • Manipulator transmission mechanism, transmission chamber and semiconductor processing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] figure 2 It is a schematic diagram of the transmission chamber with the manipulator transmission mechanism provided by the embodiment of the present invention and the manipulator is in the initial state; image 3 for will figure 2 Schematic diagram of the final state of the manipulator sending out of the transmission chamber in , please refer to figure 2 and image 3 , The manipulator transmission mechanism provided by the embodiment of the present invention includes: a first connecting piece, a guide block 11 , a transmission piece 12 , a second connecting piece, and a driver 14 . Wherein, the guide block 11 is connected with the first connector, and the first connector is used to move the guide block 11 along the first connector driven by the driver; the guide block 11 is provided with a first guide rail 111, and the manipulator is arranged on the first In the guide rail 111; the transmission part 12 is connected with the first connecting part and the second con...

Embodiment 2

[0057] The present invention also provides a transmission chamber 2, such as figure 2 and image 3 As shown, it includes a manipulator transmission mechanism and a manipulator 21, and the manipulator transmission mechanism adopts the manipulator transmission mechanism provided in the above-mentioned embodiment 1. For details, refer to the above-mentioned embodiment 1.

[0058] The transmission chamber provided by the embodiment of the present invention can improve the film transfer efficiency because the manipulator transmission mechanism provided by the above-mentioned embodiment 1 is adopted.

Embodiment 3

[0060] The present invention also provides a semiconductor processing device, including a reaction chamber and a transfer chamber, and the transfer chamber adopts the transfer chamber provided in Embodiment 2 above.

[0061] The semiconductor processing equipment provided by the embodiment of the present invention can improve the process efficiency and output because the transmission chamber provided by the above-mentioned embodiment 2 is used.

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Abstract

The invention relates to a manipulator transmission mechanism, comprising: a guide block, a first connecting piece, a second connecting piece, and a transmission piece; wherein the guide block is connected with the first connecting piece, and the first connecting piece is used to drive the guide The block moves along the first connecting piece; the guide block is provided with a first guide rail, and the manipulator is set in the first guide rail; the transmission part is connected with the first connecting piece and the second connecting piece, and the second connecting piece is connected with the manipulator for The motion of the first link is transmitted to the second link, and the second link drives the manipulator to move toward or away from the target position along the first guide rail. The invention also provides a transmission chamber and semiconductor processing equipment. Not only is the structure simple, but the transmission manipulator is in place at one time, so the film transfer time is short and the film transfer efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment manufacturing, and in particular relates to a manipulator transmission mechanism, a transmission chamber and semiconductor processing equipment. Background technique [0002] In the wafer etching process in the fields of integrated circuits, semiconductor lighting, micro-electromechanical systems, etc., plasma dry etching equipment is usually used to complete the wafer etching process. In order to improve the degree of automation and safety of equipment, chips are generally transported by automatic devices. [0003] figure 1 For a schematic diagram of a typical single-chamber semiconductor processing equipment, see figure 1 , including: a process chamber 1 and a transfer chamber 2, which are connected by a gate valve 3, and a manipulator 21 is arranged in the transfer chamber 2. Before the process, the transfer chamber 2 is in an atmospheric state, and the wafer is placed on the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67196H01L21/67742
Inventor 侯宁
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD