PCB drilling device

Abstract

The invention discloses a PCB drilling device. The PCB drilling device comprises a workbench, a three-axis movement mechanism, a drilling module, a PCB bearing carrier, an air-blowing mechanism and acontrol unit, wherein the three-axis movement mechanism is arranged on the workbench; the drilling module is connected with the three-axis movement mechanism; the PCB bearing carrier is located on theworkbench and is located below the drilling module; the air-blowing mechanism is used for cooling a PCB when the drilling module is used for drilling; and the control unit is electrically connected with the three-axis movement mechanism, the drilling module and the air-blowing mechanism. The PCB drilling device can complete drilling automatically; and the temperature during drilling can be decreased through the air-blowing mechanism, so that knife adhesion and difficult chip removal are avoided.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a PCB board drilling device. Background technique [0002] At present, domestic PCB drilling is mainly mechanical drilling, and the drilling diameter is 0.1mm-0.3mm. However, with the miniaturization and densification of drilling holes, the hole quality problems are also highlighted, and the drilling temperature is one of the most important influencing factors. At the same time, the impact of drilling temperature on the wear of drill pins is also particularly significant. The main components of PCB are copper foil, resin and glass fiber. Among them, the bonding strength of resin is easily affected by temperature changes. When the drilling temperature exceeds its glass transition temperature, on the one hand, resin residues will be generated in the hole to affect the quality of the hole. It will affect the subsequent electroplating process, on the other hand, it will make ...

AI Technical Summary

Problems solved by technology

The main components of PCB are copper foil, resin and glass fiber. Among them, the bonding strength of resin is easily affected by temperature changes. When the drilling temperature exceeds its glass transition temperature, on the one hand, resin residues will be generated in the hole to affect the quality of the hole. It will affect the subsequent electroplating process, on the other hand, it will make the resin bond in the cutting edge and the spiral groove, affect the cutting performance and chip removal performance of the drill hole, increase the unevenness of the hole wall, and accelerate the wear of the drill bit and even appear bit break

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