Optical integrated circuits

Abstract

The present invention provides optical integrated circuits. The optical integrated circuit includes a substrate including a single crystalline semiconductor material. The optical integrated circuit includes an insulation region in a trench in the substrate. The optical integrated circuit includes a first core on the insulation region. The first core includes the single crystalline semiconductor material. Moreover, the optical integrated circuit includes a second core that is spaced apart from the first core. The second core includes a material having a refractive index that is lower than thatof the first core.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2018-0042321 filed with the Korean Intellectual Property Office (KIPO) on April 11, 2018, the contents of which are hereby incorporated by reference in their entirety. technical field [0002] The present disclosure relates to optical integrated circuits. Background technique [0003] As the rate of data transmission through electronic integrated circuits has increased to the limit, methods of transmitting data through optical integrated circuits have been developed. If the optical integrated circuit is formed on a silicon-on-insulator (SOI) substrate, the production cost may increase due to the high cost of the SOI substrate, so a method of manufacturing the optical integrated circuit on a bulk substrate has recently been developed. For the fabrication of optical integrated circuits on bulk substrates, amorphous silicon can be deposited and regrown to form optical devices. However, the light loss o...

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However, the light loss of the optics can be undesirably high

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