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Coating machine, coating method and forming method of mask plate

A coating machine and coating technology, which are applied to the photomechanical processing of the originals, the pattern surface photoengraving process, the photoengraving process coating equipment, etc. Poor performance and other problems, to reduce surface residues, improve performance, and simplify the process

Pending Publication Date: 2019-10-22
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the formation method of the mask plate in the prior art is relatively complicated, and the performance of the formed mask plate is relatively poor.

Method used

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  • Coating machine, coating method and forming method of mask plate
  • Coating machine, coating method and forming method of mask plate
  • Coating machine, coating method and forming method of mask plate

Examples

Experimental program
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Embodiment Construction

[0040] There are many problems in the method for forming the mask, for example: the process is complicated and the performance of the formed mask is poor.

[0041] Now in conjunction with a method for forming a mask, analyze the reasons why the method for forming the mask is complex and the performance of the formed mask is poor:

[0042] Figure 1 to Figure 3 It is a structural schematic diagram of each step of a method for forming a mask plate.

[0043] Please refer to figure 1 , providing a light-transmitting plate 100, the light-transmitting plate 100 includes a pattern area A and a peripheral area B located on both sides of the pattern area A; a light-shielding layer 111 is formed on the surface of the pattern area A and the peripheral area B of the light-transmitting plate 100 A protective layer 121 is formed on the surface of the light-shielding layer 111, and the light-shielding layer 111 and the protective layer 121 of the pattern area A have a pattern opening 101, ...

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Abstract

The invention relates to a coating machine, a coating method and a forming method of a mask plate. The coating machine comprises: a spray head shell, a first valve and a second valve, wherein the first valve and the second valve are connected with the spray head shell, the spray head shell, the first valve and the second valve enclose an air pressure cavity, a coating seam is arranged between thefirst valve and the second valve, and the coating seam communicates with the air pressure cavity; and a nozzle positioned in the air pressure cavity of the spray head shell and internally provided with a spray hole, wherein the spray hole penetrates the nozzle, and the spray hole communicates with the air pressure cavity. The coating machine can coat specific areas.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a coating machine, a coating method and a method for forming a mask plate. Background technique [0002] Photoetching is the process of removing specific parts of the wafer surface film through a series of production steps. The goal of photolithography production is to produce feature patterns with accurate dimensions according to the requirements of the circuit design, and the correct position on the wafer surface and the correct relationship with other components. Photolithography has important applications in semiconductor technology. [0003] The method of the photolithography process includes: forming a photoresist layer on the wafer by using a spin coating process; placing the photoresist layer in an exposure device after heat treatment, and exposing the photoresist layer to form a mask plate The pattern on the photoresist layer is transferred to the p...

Claims

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Application Information

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IPC IPC(8): G03F7/16G03F1/68
CPCG03F7/16G03F1/68
Inventor 赵晗
Owner SEMICON MFG INT (SHANGHAI) CORP
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