Embedded computer circuit board packaging material

Abstract

The invention discloses an embedded computer circuit board packaging material. The embedded computer circuit board packaging material is prepared from the components of a solid polysulfide rubber, a polyurethane pressure-sensitive adhesive, silica sand, dimethyl carbonate, glass powder, epoxy resin, vinyl acetate, polyoxyethylene amine, polystyrene, dimethyl ethanolamine, polyvinyl acetate and polyethylene wax. The components are mixed according to the proportion, put into a container and heated to 130-140 DEG Cfor melting; and a circuit board to be packaged is put into a mold, the mold is filled with a melted material, the circuit board is internally wrapped, and the packaging is completed after cooling and finalizing are carried out. Compared with the prior art, the embedded computer circuit board packaging material prepared from the components packages the computer circuit board, so that the circuit board is no longer affected by dust. In addition, the packaging material has the shielding performance, prevents electromagnetic waves from interference, and has the insulation and heat conduction performance, so that the heat dissipation of the circuit board is facilitated, the long-time operation of a computer is ensured, and the embedded computer circuit board packaging material has the value of popularization and application.

Description

technical field [0001] The invention relates to the field of computer hardware, in particular to an embedded computer circuit board packaging material. Background technique [0002] The computer is composed of multiple circuit boards. The circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCB, super Thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. However, the circuit board of a computer is generally exposed outside, and the circuit board falls into dust, is subjected to electromagnetic wave interference, etc., which will affect the normal operation of the circuit board and the operating efficiency of the computer. Therefore, there is room for improvement. Contents of the invention [0003] The object of the present invention is to provide ...

AI Technical Summary

Problems solved by technology

However, the circuit board of a computer is generally exposed, and dust falling on the circuit board, interference by electromagnetic waves, etc., will affect the normal operation of the circuit board and affect the operating efficiency of the computer. Therefore, there is room for improvement.