Vacuum pump, blade component and rotor for use in vacuum pump, and fixed blade

Abstract

Provided is: a vacuum pump that can effectively prevent backflow of particles from the vacuum pump to a vacuum chamber, without the gas molecule exhaust performance of the vacuum pump being impaired,and that is ideal for preventing contamination of the inside of the vacuum chamber by backflow particles; a blade component and a rotor for use in the vacuum pump; and a fixed blade. A vacuum pump has, between an intake port and an exhaust port, a plurality of exhaust stages PT that function as means for expelling gas molecules. Between the intake port and an uppermost exhaust stage PT (PT1) of the plurality of exhaust stages PT, the vacuum pump has, as particle transport means that transport particles in the direction in which the gas molecules are expelled, blades NB that: rotate with rotaryblades 7 (71, 75) that constitute the uppermost exhaust stage PT1; and number fewer than the rotary blades 7 that constitute the uppermost exhaust stage PT1.

Description

Technical field [0001] The present invention relates to a vacuum pump used as a gas discharge mechanism of a processing chamber of a semiconductor manufacturing device, a flat panel display manufacturing device, a solar panel manufacturing device, and other vacuum chambers. It is particularly suitable for effectively removing gas molecules of the vacuum pump without compromising the performance of the vacuum pump. A vacuum pump that prevents backflow of particles (particles) from the vacuum pump to the cavity to prevent contamination of the cavity caused by the backflowing particles. Background technique [0002] Vacuum pumps such as turbomolecular pumps and threaded trough pumps are mostly used for exhausting vacuum chambers that require high vacuum. Figure 18 It is a schematic diagram of an exhaust system using a conventional vacuum pump as the gas exhaust mechanism of the vacuum chamber. Figure 19 (a) is to Figure 18 The top exhaust layer of the conventional vacuum pump shown ...

AI Technical Summary

Problems solved by technology

However, according to such a structure, since the angle formed by the surface of the upper end 7A of the rotary blade 7 and the surface (chamfered surface) of the chamfered portion MS is an acute angle, burrs caused by machining are likely to occur, and the processing cost increases. The bluntness of the machined edge produced during machining and the increase in the curvature of the convex arc surface caused by the aforementioned plating have the opposite effect of increasing the proportion of particles that flow back.

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