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Display structure, preparation method thereof, and display device

A technology for display structures and display substrates, which is applied in identification devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc. Easy to bind and increase the effect of binding space

Active Publication Date: 2021-10-01
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing micro-light-emitting diode display technology, after the backplane is bonded to the display substrate, it is impossible to realize a narrow frame or no frame backplane.

Method used

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  • Display structure, preparation method thereof, and display device
  • Display structure, preparation method thereof, and display device
  • Display structure, preparation method thereof, and display device

Examples

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Effect test

no. 1 example

[0040] like figure 1 As shown, the present invention provides a display structure, including a flexible backplane 1 and a display substrate 2 superimposed, the flexible backplane 1 includes a binding electrode 3 for binding with an integrated circuit chip, and the flexible backplane 1 is bent along a direction away from the display substrate 2 to form a bent portion 4 on which the binding electrode 3 is located.

[0041] figure 2 It is a schematic diagram of the structure after the bonding electrode is bonded to the integrated circuit chip in the first embodiment of the present invention. like figure 2 As shown, the curved portion 4 of the flexible backplane 1 is completely covered by the display substrate 2 , that is, the curved portion 4 of the flexible backplane 1 is located directly below the display substrate 2 . The bonding electrode 3 on the bent portion 4 is connected with an integrated circuit chip 5 . After the integrated circuit chip 5 is bound to the binding ...

no. 2 example

[0055] Figure 6 It is a schematic diagram of the structure after the binding electrode is bound to the integrated circuit chip in the second embodiment of the present invention. like Figure 6 As shown, based on the technical ideas of the foregoing embodiments, the present invention also provides a display structure. The difference between the display structure of the second embodiment of the present invention and the display structure of the first embodiment is that the flexible backplane 1 includes a flexible substrate , the first electrode layer formed on the flexible substrate and the metal conductive layer 105 formed on the first electrode layer, the metal conductive layer 105 electrically connects the first electrode layer of the flexible backplane 1 to the connection electrodes of the display substrate 2 connect.

[0056] In an embodiment, the method for forming a metal conductive layer includes:

[0057] (1) Form a flexible backplane. Forming a flexible backplane ...

no. 3 example

[0060] Based on the technical ideas of the foregoing embodiments, the present invention further provides a display device, including the display structure of the foregoing embodiments.

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Abstract

The present invention provides a display structure, a preparation method thereof, and a display device. The display structure includes a flexible backplane and a display substrate that are superimposed, and the flexible backplane includes binding electrodes for binding with integrated circuit chips. The flexible backplane is bent to form a bent portion, and the binding electrodes are located on the bent portion; thereby realizing a backplane with a narrow frame or no frame.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display structure, a preparation method thereof, and a display device. Background technique [0002] As a composite integration technology combining display technology and light-emitting diode lighting technology, micro light-emitting diodes (Mini / Micro LED) have many advantages such as self-illumination, high efficiency, low power consumption, high integration, and high stability, and have broad market prospects. The micro-light-emitting diode display technology needs to transfer tens of millions of RGB or monochrome micro-light-emitting diode chips to the display substrate to achieve large-scale display. In order to realize large-scale splicing of micro-light-emitting diode displays, the backplane needs to have extremely narrow borders. However, in the existing micro-light-emitting diode display technology, after the backplane is bonded to the display substrate, it is impos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L23/49H01L23/50H01L25/16H01L21/60H01L21/48G09F9/30G09F9/33
CPCH01L23/481H01L23/49H01L23/50H01L25/167H01L25/50H01L21/4814H01L21/4885G09F9/301G09F9/33H01L27/156H01L25/18H01L24/16H01L2224/16227H01L23/4985H01L23/49833H01L23/5387H01L24/32H01L2224/32111H01L2224/3223
Inventor 刘英伟王珂梁志伟狄沐昕曹占锋梁爽袁广才姚琪刘冬妮
Owner BOE TECH GRP CO LTD