Radiofrequency chip and radiofrequency device
A technology of radio frequency chips and radio frequency devices, which is applied in the field of communication and can solve problems such as low reliability, low performance, and poor heat dissipation
Active Publication Date: 2019-11-12
臻智微芯(广州)技术有限公司
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- Description
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- Application Information
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Problems solved by technology
[0003] However, in the existing technology, especially the RF chips used in the front end, such as RF switches, etc. have low performance, poor heat dissipation, and low reliability.
Method used
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Embodiment Construction
[0025] The core of the invention is to provide a radio frequency chip. Please refer to figure 1 as well as figure 2 , figure 1 It is a power flow diagram of the radio frequency connection line in the radio frequency chip in the prior art; figure 2 It is the distribution diagram of the electric field intensity of the radio frequency connecting line in the radio frequency chip in the prior art. In the prior art, since the power flow in the radio frequency connection line spreads slowly along the width direction of the radio frequency connection line, the end of the entire radio frequency connection line close to the signal input pad bears most of the entire radio frequency power. The electric field intensity is the highest at the position of the RF connection line, and the electric field intensity distribution is relatively uniform in the middle part of the RF connection line; the electric field intensity is the weakest at the end of the RF connection line close to the sign...
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The invention discloses a radiofrequency chip comprising a radiofrequency chip body, a signal input bonding pad on the surface of the radiofrequency chip body, and a signal output bonding pad on the surface of the radiofrequency chip body, wherein the radiofrequency chip body comprises at least one radiofrequency device module; the signal input bonding pad and the signal output bonding pad are connected to the radiofrequency device module through radiofrequency connection lines; each radiofrequency connection line includes at least one hollow-out array; the hollow-out array includes a plurality of hollow-out holes distributed along the length direction of the radiofrequency connection line, and extends from an end portion of the radiofrequency connection line connected with the signal input bonding pad to an end portion of the radiofrequency connection line connected with the signal output bonding pad. The hollow-out array can cause an electric field in the radiofrequency connection line to be distributed along the width direction of the radiofrequency connection line, such that the power flow in the radiofrequency connection line more uniform and the electric field intensity distribution in the radiofrequency connection line is more uniform. The present invention also provides a radiofrequency device that also has the above beneficial effects.
Description
technical field [0001] The invention relates to the technical field of communications, in particular to a radio frequency chip and a radio frequency device. Background technique [0002] The fifth generation (5G) mobile communication standard is advancing in an orderly manner, and the next generation of mobile terminals such as smartphones, tablets and wearable devices will surely need to support more working modes and frequency bands. In addition, in order to support so many wireless communication protocols, multiple antenna designs are increasingly adopted to achieve multiple-input multiple-output (MIMO) operation to achieve high data rates, improve sensitivity and avoid crosstalk. [0003] However, in the prior art, especially the radio frequency chips used in the front end, such as radio frequency switches, have low performance, poor heat dissipation, and low reliability. Therefore, how to improve the performance, heat dissipation and reliability of the radio frequency ...
Claims
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IPC IPC(8): H01L23/488
CPCH01L23/488
Inventor 钟立平陈思弟王卓蓝焕青张志浩章国豪
Owner 臻智微芯(广州)技术有限公司