High-frequency micro-amplitude vibration device applied to ultra-fast polishing of large-caliber complex curved surface

Abstract

The invention discloses a high-frequency micro-amplitude vibration device applied to ultra-fast polishing of a large-caliber complex curved surface. The high-frequency micro-amplitude vibration devicecomprises a voice coil motor vibration platform capable of moving in two-dimensional direction and a flexible multi-layer polishing disc arranged on the voice coil motor vibration platform, wherein the flexible multi-layer polishing disc is composed of a rigid polishing bottom plate, a flexible polishing layer and a polishing section which are sequentially connected, and the flexible polishing layer adopts an elastic material with a deformation response time of tens of milliseconds to hundreds of milliseconds. By controlling the amplitude and the phase of a voice coil motor of each dimension,the movement of the specified amplitude and the designated direction of the polishing disc can be realized. According to the high-frequency micro-amplitude vibration device, and the surface roughnesscan be quickly improved under the premise of maintaining the surface shape error.

Description

technical field [0001] The invention relates to the technical field of ultra-precision optical processing, in particular to a high-frequency micro-amplitude vibration device for ultra-fast polishing of large-diameter complex curved surfaces, especially for large-diameter complex curved surfaces of materials such as silicon carbide, silicon, fused quartz, and ULE Mirror polished. Background technique [0002] When traditional large-diameter and ultra-large-diameter silicon carbide, silicon, fused silica, ULE and other materials with complex curved surfaces are transferred from the precision grinding stage to the polishing stage, they need to go through a long sub-aperture polishing process, with many iterations and low polishing efficiency. , It takes too long, and it is very easy to appear that the roughness of some local low areas after polishing is different from that of other areas. During the interferometer detection process, there are often bad data points, which cannot...

AI Technical Summary

Problems solved by technology

In the traditional CCOS scheme, the polishing disc is mostly composed of common polishing materials such as asphalt and polyurethane, and the optical processing is realized in a way similar to planetary revolution and rotation with a large amplitude (5-50mm) and low frequency (1-10Hz) through the mechanical structure. In the process of processing free-form optical elements with large asphericity or multiple inflection points, although the self-fluidity of asphalt can satisfy the polishing disc and optical elements to a certain extent, the asphalt’s Self-fluidity cannot meet the polishing requirements, which directly leads to the inability to fully process some areas with low local area.

[0003] Aiming at another common medium and high frequency surface error problem in the optical processing process, due to the long cumulative processing time, it is easy to form a certain spatial frequency surface error on the surface of the optical element

The introduction of this kind of error will easily cause the surface error of optical components to fail to converge, so it is very necessary to take measures to eliminate the proportion of medium and high frequency surface errors

The traditional CCOS processing method is to use an asphalt disc with a relatively large caliber and brand hardness for sub-aperture polishing

The disadvantage of using this method is that although the proportion of medium and high frequency surface error is reduced, it will destroy the original good low frequency surface error to a certain extent.

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