Welding spot height detection tool for printed circuit board plug-in

Abstract

The invention discloses a welding spot height detection tool for a printed circuit board plug-in. The detection tool comprises a fixed board, a detection boardmounted below the fixed board and supporting legswhich are fixed at two ends of the fixed board and extend downwards, wherein the lower end surfaces of the two supporting legs are placed on the surface of the printed circuit board and can slide along the surface, the lower surface of the detection board is higher than the lower end surfaces of the supporting legs, and the vertical distance between the lower surface of thedetection boardand the lower end surfaces of the supporting legs is the technological requirement height; if the detection tool slides smoothly along the surface of the printed circuit board, the welding spot heightis qualified. The detection tool can quickly detect height of welding spots in batches, improves working efficiency, avoids missing welding spots, ensures complete detection, improves safety of products, avoids human errors and improves reliability of the products.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a tool for detecting the height of solder joints of a printed circuit board insert. Background technique [0002] In the assembly process of electronic products, the issue of safe insulation is one of the key points of the prohibition and restriction process. In order to ensure the reliability of the product, it is required that the metal shell, pins, and exposed leads of the components should have the same structure as the metal shell and other structural parts. A certain safety gap. In some special applications, due to the restriction of safety clearance, the height of solder joints of through-hole inserts is strictly limited. If it exceeds a certain height, it will cause safety and reliability problems. [0003] Under the above process requirements, it is required that the solder joint height of components should be strictly controlled during the electronic assembly proc...

AI Technical Summary

Problems solved by technology

After the soldering and assembly of the printed circuit board assembly is completed, the pin height of the through-hole insert needs to be inspected. At present, the commonly used inspection method is to use a vernier caliper to measure the height of each pin. This inspection method has many problems. , the vernier caliper needs to measure the height of the solder joints of each component pin, which is inefficient for a large number of solder joints on the printed circuit board; the solder joints on the printed circuit board components are randomly distributed, and it is easy to miss during the measurement process A certain solder joint leaves a potential safety hazard; the measurement process is a contact measurement. Due to the differences in personnel operations, it is easy to form additional stress on the solder joints of the component pins and affect the reliability of the solder joints.

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