Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

In-situ aging sensor and aging monitoring method based on backup circuit

A backup and circuit technology, applied in electronic circuit testing, instruments, measuring electricity, etc., can solve the problems of large chip area overhead, unreliable measurement results, and the performance of the monitored circuit, so as to ensure high reliability and performance without Influence, effect of high-precision aging measurement

Active Publication Date: 2019-11-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF7 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional copy circuit aging sensor is greatly affected by the deviation of the integrated circuit process, which leads to the fact that the copy circuit cannot accurately represent the aging condition of the original circuit, and its measurement results are unreliable; due to the uncertainty of the circuit temperature changing with the load, the traditional principle The in-situ aging sensor cannot accurately measure the real aging of the circuit; the in-situ aging sensor based on path delay measurement needs to introduce a delay chain, which brings a large chip area overhead, which has a greater impact on the performance of the monitored circuit

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • In-situ aging sensor and aging monitoring method based on backup circuit
  • In-situ aging sensor and aging monitoring method based on backup circuit
  • In-situ aging sensor and aging monitoring method based on backup circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0040]Modern digital integrated circuits are designed at the RTL level, that is, the register transfer level. Whether it is a pipeline structure or any other structure, the basic unit of circuit logic is basically composed of a combinational logic circuit between registers, and the aging of the circuit often occurs in combinational logic. part of the circuit unit. In order to effectively offset the effects of process, voltage, and temperature on aging monitoring, and to ensure the circuit performance during online testing as much as possible, the present invention proposes an in-situ aging sensor and aging monitoring method based on a backup circuit.

[0041] Based on the aging monitoring method of the backup circuit, a b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an in-situ aging sensor and an aging monitoring method based on a backup circuit. The in-situ aging sensor comprises a backup combinational logic unit, multiple multiplexers and a counter. The aging monitoring method comprises the steps as follows: setting the backup combinational logic unit identical with a primary circuit combinational logic unit; testing the primary circuit combinational logic unit and the backup combinational logic unit at different moments ti (i is equal to 0, 1, 2...) respectively to obtain total delay values of the two units at different momentsti; comparing total delay values of the two units at the tn moment with total delay values of the two units at the tm moment respectively, correcting the comparison value of the primary circuit combinational logic unit by use of the comparison value of the backup combinational logic unit to obtain the aging coefficient of the primary circuit combinational logic unit from the moment tm to the moment tn. High-precision aging measurement is realized, effects of process and temperature on aging monitoring are offset, high reliability of military electronic equipment circuits is guaranteed, and hidden risks of circuits can be discovered timely.

Description

technical field [0001] The invention relates to the field of circuit aging monitoring, in particular to an in-situ aging sensor based on a backup circuit and an aging monitoring method suitable for military electronic equipment. Background technique [0002] Integrated circuits are facing more and more challenges after entering the nanometer era, especially with the increase of integration, the change of device parameters over time will bring more and more influence (such as wear, accumulation of crystal defects, radiation , aging, etc.), which makes the random effect in nanotechnology larger, which shows variability in the circuit, resulting in a more serious error rate and seriously affecting the reliability of the circuit. [0003] Military electronic equipment has high requirements for circuit reliability, especially the control operation circuit represented by the processor. The clock cycle causes the flip-flop to sample the wrong signal value, so detecting whether the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2855
Inventor 赵天津黄乐天李强
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products