Film forming composition

A composition and member technology, applied in the direction of coating, etc., can solve the problem of insufficient curing speed and achieve the effect of excellent coatability

Active Publication Date: 2019-11-15
MERCK PATENT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, according to research by the inventors of the present invention, in conventionally known compositions, the curing speed at low temperatures such as room temperature is not sufficient, and in order to improve the curing speed, it is sometimes necessary to perform heating, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～15 and comparative example 1～2

[0138] Perhydropolysilazane (number average molecular weight: 800) and additives were dissolved in xylene, and filtered through a PTFE membrane filter with a pore size of 0.2 μm to obtain a composition. The content of perhydropolysilazane in the composition was set to 8% by mass based on the composition. The kinds and concentrations of additives are as shown in Table 1.

[0139] The obtained compositions were each applied to a 4-inch silicon wafer using a spin coater (manufactured by Mikasa Co. Ltd.). About coating conditions, it set so that the film thickness of the obtained film might become 200 nm.

[0140] Thereafter, curing is performed at room temperature, 80°C, or 130°C. The progress of hardening was observed by FT-IR. Then, the time (number of days) until the perhydropolysilazane was completely converted to silica under each condition was measured. The obtained results are shown in Table 1.

[0141] Table 1

[0142]

[0143]

[0144] *1: The content of addi...

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Abstract

[Problem] To provide a film forming compositioncurable at low temperatureand a film forming method using the same. [Means for Solution] A film forming composition comprising a polysilazane, an organicsolvent and aspecificadditive, and a film formingmethod comprisingapplying itona substrate and curing. The specific additiveisselected from the group consisting of (A) guanidines substituted by a hydrocarbylgroup, (B) crown ether amines containing oxygen and nitrogen as a member thereof, (C) cycloalkanes having an amino-substituted polycyclic structure, (D) oximes substituted by a hydrocarbyl group, and (E) imidazolines.

Description

technical field [0001] The present invention relates to a composition containing polysilazane. More specifically, it relates to a film-forming composition capable of forming a dense siliceous film by a curing reaction at a low temperature. Background technique [0002] Polysilazane has a property of being converted into a siliceous substance by heating. When a general polysilazane is used alone, there are many points to be improved, for example, the conversion rate to a silica-based substance is slow, or high temperature is required for conversion to a silica-based substance, and the like. Therefore, various studies have been conducted to improve such a problem. [0003] For example, studies are underway to improve the above-mentioned problems by modifying polysilazane itself or combining specific additives with polysilazane-containing compositions. Specifically, as a method capable of forming a siliceous film at a low temperature, there are methods of adding an N-heteroc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/16C08K5/00C08L83/16
CPCC08G77/62C09D183/16C08K5/01C08K5/17C08K5/31C08K5/33C08K5/3445C08K5/35C09D7/40C08K5/175C08K5/29C08K5/3447C08K5/3462C08K5/357
Inventor 能谷刚久保雅彦佐竹昇野岛由雄尾崎祐树冈村聪也
Owner MERCK PATENT GMBH
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