Laser etching processing-oriented pattern segmentation method and laser etching control system

Abstract

The invention belongs to the technical field of laser etching, and discloses a pattern segmentation method for laser etching processing, and a laser etching control system, and the method comprises the steps: calculating a normal vector of a mapping point; winding the two-dimensional vector maps on the surface of the three-dimensional grid model, calculating a transformation matrix of each two-dimensional vector map, and winding the maps on the surface of the three-dimensional grid model based on a geometric transformation principle; determining a search range according to the scanning range of the scanning galvanometer and the maximum focal depth, and obtaining a mapping pattern associated with each processing area; for one processing area, determining a segmentation plane according to the position of the central point, projecting the boundary line of the processing area and the associated pattern onto the segmentation plane, and segmenting the pattern; and according to the back projection coordinate system, generating a machinable file required by the machining party. The moving times of the scanning galvanometer in a traditional method can be effectively reduced, and the actualmachining efficiency is improved; and the pattern of each processing area can be efficiently segmented, and meanwhile, the precision of the pattern is ensured.

Description

technical field [0001] The invention belongs to the technical field of laser etching, and in particular relates to a pattern segmentation method for laser etching processing and a laser etching control system. Background technique [0002] With the continuous development of laser etching processing technology, the processing technology of large-scale and complex model surface patterns has become a very important technical requirement. Nowadays, the shape of the model to be processed is becoming more and more complex, and the format is getting larger and larger. When the texture pattern is small, more texture points are required. In this case, the five-axis motion mechanism of the laser etching system will frequently Move to determine the position of the next processing pattern, so that the actual processing efficiency is low. At this time, a larger texture pattern is usually used to reduce the number of texture points. However, when a larger textured pattern is introduced,...

AI Technical Summary

Problems solved by technology

[0003] To sum up, the problems existing in the existing technology are: the applicable range of the existing laser processing method for the surface pattern of the large-scale three-dimensional mesh model is very limited, and it is difficult to guarantee the processing accuracy of the pattern when the curvature of the surface changes greatly. Most of the graphic elements to be processed at the same time are mainly line segments, which is difficult to meet the actual processing needs

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