A chip using a microthermal generator

Abstract

The invention relates to a chip using a micro-hot spot generator, including an operation chip, an N-type semiconductor film, a P-type semiconductor film, a nano-carbon heat dissipation film, and a conductive metal foil. There are at least three operation chips, and the two adjacent layers of operation chips At least one N-type semiconductor film and at least one P-type semiconductor film are respectively arranged between them, and an N-type semiconductor film and a P-type semiconductor film located in the same plane are electrically connected to each other through a conductive metal foil; nano-carbon heat dissipation Among the operation chips, the upper end surface of the uppermost operation chip and the lower end surface of the lowermost operation chip are respectively coated. On the one hand, the present invention can effectively realize the overall cooling capability of the chip during operation, and help to improve the cooling performance of the chip during operation; recycling rate.

Description

technical field [0001] The invention relates to a smoke detection device, in particular to a chip using a microthermal generator. Background technique [0002] At present, with the reduction of circuit system and chip structure size, especially the development of 3D IC technology, the current chip structure is getting smaller and smaller, and the chip power density is getting higher and higher. Although the circuit structure is effectively simplified, it also leads to chip operation. The calorific value is relatively high, so it is very easy to cause circuit equipment failure due to high temperature, which seriously affects the stability and reliability of electrical equipment operation. Adding cooling equipment such as heat dissipation fans, water-cooled heat exchangers, and air-cooled heat exchangers can meet the needs of chip heat dissipation and cooling to a certain extent, but on the one hand, it seriously affects the operating efficiency of the chip circuit, and on the...

AI Technical Summary

Problems solved by technology

[0002] At present, with the reduction of circuit system and chip structure size, especially the development of 3D IC technology, the current chip structure is getting smaller and smaller, and the chip power density is getting higher and higher. Although the circuit structure is effectively simplified, it also leads to chip operation. The calorific value is relatively high, so it is very easy to cause circuit equipment failure due to high temperature, which seriously affects the stability and reliability of electrical equipment operation. Adding cooling equipment such as heat dissipation fans, water-cooled heat exchangers, and air-cooled heat exchangers can meet the needs of chip heat dissipation and cooling to a certain extent, but on the one hand, it seriously affects the operating efficiency of the chip circuit, and on the other hand, it leads to the current chip. The circuit needs to be equipped with a heat dissipation system with a complex structure, which leads to a complex structure of the circuit equipment. To solve this problem, although a chip structure that achieves the purpose of cooling by adding a thermoelectric power generation mechanism has also been developed in the chip structure, such as the application number "2016205099272" " The patent of "3D chip using micro-thermoelectric generator" can realize the direct conversion of thermal energy into electric energy by the chip itself, so as to reduce the operating temperature of the chip, but the structure of the thermoelectric power generation system and the arrangement of the chip used in this patent are relatively complicated. And the heat exchange efficiency is relatively poor, and at the same time, there is no effective management of the electric energy obtained by the temperature difference power generation when the chip is running, so it causes great inconvenience to the actual use

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