Preparation method of PI substrate and display device thereof
A technology for substrates and glass substrates, which is applied in semiconductor/solid-state device manufacturing, photovoltaic power generation, electrical components, etc. It can solve the problems of bubble formation in the film layer, inability to stabilize the bubble control of the PI film layer, and bubble generation in the film layer, etc., to achieve good discharge bubble effect effect
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[0043] A method for preparing a PI substrate and a technical solution of a display device thereof according to the present invention will be further described in detail with reference to the accompanying drawings and embodiments.
[0044] see figure 1As shown, one embodiment of the present invention provides a method for preparing a PI substrate, which includes a PI coating preparation step S1, a solvent removal treatment step S2, a constant temperature film formation treatment step S3, and a laser treatment surface step S4.
[0045] Each step will be described in detail below.
[0046] Step S1, PI coating preparation, which is to provide a glass substrate, and coat a layer of PI material solution on the glass substrate to form a PI coating on the surface of the substrate. The glass substrate used therein is generally, but not limited to, a silicon glass substrate. The PI material solution involved in use is also various PI materials known in the industry that can be used fo...
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