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Circuit board production method, circuit sheet and circuit board

A technology of circuit substrate and manufacturing method, which is applied in the directions of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve problems such as the inability to cope with the requirement of miniaturization of circuit substrates

Inactive Publication Date: 2019-11-22
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it may not be able to meet the demand for miniaturization of circuit boards

Method used

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  • Circuit board production method, circuit sheet and circuit board
  • Circuit board production method, circuit sheet and circuit board
  • Circuit board production method, circuit sheet and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0154] A copper plate with a thickness of 500 μm was used to form a circuit by punching and cutting using a mold, and was fixed on the adhesive film so that the position did not shift. Next, the circuit was fixed to the mold, and an epoxy resin (Hitachi Chemical Co., Ltd., model: CEL-4650M, linear expansion rate: 14ppm / °C) was applied using a transfer press machine (manufactured by T-marushichi Co., Ltd., general-purpose press) It is filled in the space between the circuits, and subjected to a press treatment under predetermined conditions (temperature: 175° C., pressure: 8 MPa, time: 3 minutes) to form a resin portion. Next, the circuit was released from the mold, the adhesive film was peeled off, the burrs were removed by cutting, and post-curing was performed by heating at an oven temperature of 180° C. for 6 hours to produce a circuit sheet. The thickness of the resin portion in the circuit sheet is the same as the thickness of the circuit.

[0155]The prepared circuit sh...

Embodiment 2

[0158] Using a copper plate with a thickness of 1000 μm instead of a copper plate with a thickness of 500 μm to make a circuit sheet (the thickness of the resin part is the same as the thickness of the circuit), and using a copper plate with a thickness of 1000 μm instead of a copper plate with a thickness of 500 μm as a heat sink, it is the same as in Example 1. Operation, making circuit board.

Embodiment 3

[0160] Using a copper plate with a thickness of 2000 μm instead of a copper plate with a thickness of 500 μm to make a circuit sheet (the thickness of the resin part is the same as the thickness of the circuit), and using a copper plate with a thickness of 2000 μm instead of a copper plate with a thickness of 500 μm as a heat sink, it is the same as Example 1. Operation, making circuit board.

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Abstract

This circuit board production method comprises the step of disposing, over a board, a circuit sheet comprising circuits and a resin portion provided in the space between the circuits.

Description

technical field [0001] The invention relates to a manufacturing method of a circuit substrate, a circuit sheet and a circuit substrate. Background technique [0002] As electronic devices become smaller and more functional, printed circuit boards are widely used as circuit boards on which electronic components can be mounted at a high density. A printed circuit board is generally produced by attaching metal foil to a substrate, etching it, and processing it into a desired circuit shape. [0003] On the other hand, as the environments in which electronic devices are used diversify, it is required to increase the current capacity of the circuit board (higher current). The current capacity of the circuit substrate can be increased by increasing the cross-sectional area of ​​the circuit (conductor). However, for printed circuit boards, it is technically difficult to increase the thickness of the circuit by forming the circuit by etching. For example, the cross-sectional shape...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/20
CPCH05K3/202H05K3/0014H05K2201/09118H05K3/0061H05K3/007H05K3/20H05K3/285H05K2203/0228
Inventor 西山智雄户川光生竹泽由高中村优希木口一也宫崎靖夫天沼真司
Owner RESONAC CORPORATION