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Photosensitive resin composition and application thereof

A technology of photosensitive resin and resin composition, which is applied in the direction of optics, optomechanical equipment, instruments, etc., to achieve the effects of small film fragments, improved production efficiency and product yield, and good adhesion

Active Publication Date: 2019-11-29
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent document CN102144189B provides a kind of photosensitive resin composition, by adding polyoxyethylene (tris(1-phenylethyl)) phenyl ether modified by ethylene oxide, its resolution, adhesion, capping performance Excellent, but there is still room for improvement in peel performance

Method used

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  • Photosensitive resin composition and application thereof
  • Photosensitive resin composition and application thereof

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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present invention belongs.

[0031] 1. Specific components and their weight ratios in the photosensitive resin compositions of Examples 1-9 and Comparative Examples 1-2 (see Table 1)

[0032] (1) Alkali-soluble resin A: prepared by solution pol...

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Abstract

The invention discloses a photosensitive resin composition and application thereof. The resin composition comprises: in parts by weight, 40 to 70 parts of alkali-soluble resin, 20 to 50 parts of photopolymerization monomer, 0.5 to 10.0 parts of photoinitiator and 0.1 to 10.0 parts of additive, wherein the photopolymerization monomer comprises 0.5 to 15.0 parts by weight of a monomer containing a carbonate ester structure. The photosensitive resin composition is used as a dry film resist, has the characteristics of easy film stripping breakage, small film stripping fragments, high film stripping speed and the like, and has favorable line resolution and adhesive force, thereby effectively enhancing the production efficiency and product yield.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a photosensitive resin composition and its application. Background technique [0002] In the field of production of printed circuit boards, photosensitive resin compositions are widely used as resist materials used in etching or plating. With the development of electronic equipment towards thinner and smaller, the corresponding requirements for higher precision and higher density of printed circuit boards, which put forward higher requirements for the resolution, adhesion, development time and film removal rate of the photoresist layer. requirements. Among them, film removal is a key process in the production of printed circuit boards. The cleanliness of film removal on the board directly affects the production and product yield of subsequent processes, and the film removal speed affects production efficiency. [0003] In the conventional printed circuit board ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027
CPCG03F7/027
Inventor 朱高华李伟杰周光大
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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