Ceramic adapter plate for improving temperature characteristics of differential silicon vibration beam accelerometer

Abstract

The invention discloses a ceramic adapter plate for improving temperature characteristics of a differential silicon vibration beam accelerometer. The adapter plate comprises an adapter plate body; anda cross-shaped through hole is formed in the middle of the adapter plate body. Four metal right-angle frame lines are printed on the surface of the adapter plate body; and the four metal right-angleframe lines and the edge of the cross-shaped through hole form four rectangular bonding faces jointly and the whole structure is in central symmetry. According to the invention, the ceramic adapter plate has the following advantages: the adverse effect of the fluidity of an adhesive on the shape of the contact part of an adhesive layer and a chip is eliminated; the symmetry of the overall structure of the differential silicon vibration beam accelerometer after four points are coated with adhesives is improved; and the accelerometer gives full play to the inhibition effect on the common-mode interference caused by thermal stress, so that the temperature performance of the accelerometer is improved.

Description

technical field [0001] The invention belongs to the technical field of MEMS packaging, and in particular relates to a ceramic adapter plate for improving the temperature characteristics of a differential silicon vibrating beam accelerometer. Background technique [0002] The silicon beam accelerometer is an acceleration sensor that converts the acceleration into the frequency change of the resonator according to the force-frequency characteristics of the resonator. The silicon vibrating beam accelerometer is mainly composed of a detection mass, a lever structure, a resonator and a support mechanism. Among them, the two levers and the two resonators are symmetrically distributed. The frequency of the resonator increases and the frequency of the other resonator decreases, and the input acceleration can be obtained by calculating the difference between the frequencies of the two resonators. Therefore, this structurally symmetrical differential silicon beam accelerometer can ef...

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Problems solved by technology

However, due to the fluidity of the adhesive, the shape of each bonding point is irregular, especially the shape of the contact part between the adhesive and the chip. Therefore, the symmetry of the adhesive layer coated at four points is poor, so that the thermal stress is in the structure. The distribution is uneven, which reduces the effect of the accelerometer differential structure on suppressing the common mode error and affects the temperature performance of the accelerometer

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