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Three-dimensional cycloid-like intelligent polishing method guided by Hilbert curve

A curve-guided, pendulum-like technology, applied in the field of mechanical processing, can solve the problems of unstable polishing quality, low processing efficiency, complex parameter relationship, etc., and achieve the effect of ensuring polishing uniformity, increasing multi-directionality, and improving surface quality.

Inactive Publication Date: 2019-12-03
SOUTH CHINA UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional polishing process is mostly manual processing, heavily dependent on the technical level of the laborers, the polishing quality is unstable, and there are defects of low processing efficiency, which contradicts the mode of modern large-scale automated batch production
[0003] At present, there are obvious processing marks on the surface of the polished workpiece and uneven track coverage in the automatic surface polishing track, which affects the surface quality of the workpiece.
The trajectories traditionally used in mechanical polishing are mostly simple scanning trajectories, single fractal trajectories, or cycloidal trajectories based on scanning lines. Although these trajectories can reduce the surface roughness of the workpiece during polishing, they cannot simultaneously remove materials uniformly and A good balance effect is achieved between multi-directionality, and it is impossible to truly simulate the manual polishing process trajectory on the entire processing area
[0004] In addition, in the current research, simply combining several trajectories will generate more additional parameters, and the relationship between the parameters is complicated and interrelated, and it is impossible to directly achieve a satisfactory effect through manual adjustment.

Method used

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  • Three-dimensional cycloid-like intelligent polishing method guided by Hilbert curve
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  • Three-dimensional cycloid-like intelligent polishing method guided by Hilbert curve

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Embodiment

[0054] This embodiment provides a three-dimensional cycloid-like intelligent polishing method guided by a Hilbert curve. The flow chart is as follows figure 1 shown, including the following steps:

[0055] Step 1. Obtain the 3D grid model information of the workpiece, transform the mapping of the 3D grid surface into a 2D grid plane, and establish the spatial mapping relationship between the 3D grid surface and the 2D grid plane. The spatial mapping relationship between the grid surface and the 2D grid plane refers to: flatten the 3D grid surface model into a 2D grid plane model in the parameter domain, and establish the 3D grid surface model and the 2D grid plane model The one-to-one correspondence between the coordinates of each vertex is used to obtain the spatial mapping relationship between the three-dimensional mesh surface model and the two-dimensional mesh plane model.

[0056] Step 2, generate a standard Hilbert curve in the two-dimensional parameter domain, and carr...

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Abstract

The invention discloses a three-dimensional cycloid-like intelligent polishing method guided by a Hilbert curve. The three-dimensional cycloid-like intelligent polishing method comprises the followingsteps: establishing a space mapping relationship between a three-dimensional curved surface and a two-dimensional plane of a workpiece; generating a standard Hilbert curve in the two-dimensional parameter domain, and performing deformation to obtain an improved Hilbert curve; taking the improved Hilbert curve as a guide line, and generating a cycloid track with adjustable step pitch and radius; fitting a polishing processing material removal calculation model by utilizing an artificial neural network, and predicting an average value and a mean square error of the material removal depth of each vertex of the three-dimensional grid curved surface; constraining the value range of each parameter of the polishing track; taking an average value and a mean square error of the material removal depth as optimization targets, and determining an optimal value combination of adjustable parameters in the cycloid trajectory by utilizing an intelligent optimization algorithm; projecting the cycloidtrajectory determined by the parameters to a two-dimensional plane, and reordering the disconnected trajectories on the boundary to form a complete cycloid trajectory; and inversely mapping the cycloid trajectory on the two-dimensional plane to the three-dimensional curved surface to obtain a final actually processed three-dimensional cycloid-like trajectory.

Description

technical field [0001] The invention relates to the field of machining, in particular to a three-dimensional cycloid-like intelligent polishing method guided by a Hilbert curve. Background technique [0002] The surface quality of key components in various types of equipment is a crucial factor to ensure product quality and improve product performance. Polishing is an important processing technology in the process of obtaining the surface quality of these key components. However, the traditional polishing process is mostly manual processing, which is heavily dependent on the technical level of the laborers. The polishing quality is not stable, and there are defects of low processing efficiency, which contradicts the mode of modern large-scale automated batch production. [0003] At present, there are obvious processing traces on the surface of the polished workpiece and uneven track coverage in the automatic surface polishing track, which affects the surface quality of the w...

Claims

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Application Information

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IPC IPC(8): G06F17/50G06N3/08
CPCG06N3/08
Inventor 王清辉王康许晨旸
Owner SOUTH CHINA UNIV OF TECH
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