Liquid metal composite oscillation heat pipe type thermal temperature difference power generation and refrigeration radiator

Abstract

The invention discloses a liquid metal composite oscillation heat pipe type thermal temperature difference power generation and refrigeration radiator. A liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference power generation and refrigeration radiator or a liquid metal composite snake-shaped loop oscillation heat pipe type thermal temperature differencepower generation and refrigeration radiator is adopted. The liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference power generation and refrigeration radiator comprises a liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference generator, a liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference refrigerator, an O-shaped parallel oscillation heat pipe, a working medium, an intelligent controller, a storage battery and a circuit, wherein the liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference generator and the liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference refrigerator are respectively connected with the O-shaped parallel oscillation heat pipe, and the liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference generator and the liquid metal composite O-shaped parallel oscillation heat pipe type thermal temperature difference refrigerator are respectively connected with the storage battery through the circuit.

Description

technical field [0001] The invention relates to the technical field of heat dissipation for electronic chips, and more specifically relates to a liquid metal composite oscillating heat pipe type thermal temperature difference power generation and cooling radiator. Background technique [0002] With the rapid development of 5G and artificial intelligence technology in various countries around the world, the science and technology of electronic and electrical equipment are also facing rapid development. Electronic chips and equipment have been more and more widely used in various fields such as military, communication, people's life and commerce. . Electronic and electrical equipment manufacturers have taken improving the performance of electronic chip products, as well as improving the portability and environmental adaptability of electronic equipment as the main research goals. Therefore, the new generation of electronic chips and related equipment are moving toward high per...

AI Technical Summary

Problems solved by technology

Now the most used technologies are forced convection heat transfer and heat pipe heat transfer, but with the rapid development of science and technology, forced convection heat transfer technology is increasingly unable to meet the requirements of today's electronic chips and equipment due to the limitation of its limit heat transfer. need

In the heat pipe heat dissipation technology, the traditional heat pipe is one of the most widely used heat dissipation technologies at present. However, the traditional heat pipe needs a liquid-absorbing core, so the structure is relatively complicated, which restricts the improvement of its heat transfer performance, and its structural variability is also low. , especially the adaptability to electronic equipment in narrow spaces is also low

Faced with the current trend of high integration and high heating power of electronic chips and equipment, traditional heat pipes can no longer fully meet the development needs of electronic equipment. Faced with the urgent need to adopt new materials, new technologies, new methods and new equipment, people need to research and develop A new generation of electronic chip heat dissipation equipment to adapt to the rapid development trend of today's electronic chips and equipment

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