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Cutting solution supply device and method

A technology for supplying device and cutting fluid, applied in fine working devices, working accessories, stone processing equipment, etc., can solve problems such as affecting normal production, liquid overflow, affecting the yield of silicon wafers, etc.

Inactive Publication Date: 2019-12-13
LONGI GREEN ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The cutting fluid will produce cutting foam during the cutting process, and the cutting fluid will contact with the air when it falls into the cutting fluid storage tank during recycling, and will collide with it to generate additional cutting foam. The increase in the foam contained in the cutting fluid will cause the collapse The abnormal increase of side and so on affects the yield of silicon wafers
At the same time, the foam generated during the recycling process of the cutting fluid will cause the liquid in the liquid storage tank to overflow, affecting normal production

Method used

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  • Cutting solution supply device and method
  • Cutting solution supply device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This embodiment provides a cutting fluid supply device, the structure of which is as follows: figure 1 As shown, it includes a cutting chamber 2, a liquid storage tank 1, a liquid extractor 5 and a connector 6. The liquid extractor 5 supplies the cutting fluid in the liquid storage tank 1 to the cutting fluid in the cutting chamber 2 through the cutting chamber liquid inlet 9. The liquid spray pipe 3 sprays the cutting liquid to the main roller 4 of the cutting assembly through the cutting liquid spray pipe 3. One end of the connector 6 communicates with the cutting chamber 2, and the other end communicates with the liquid storage tank 1. The cutting in the cutting chamber 2 The liquid is supplied to the liquid storage tank 1 through the connector 6, and the arrow in the figure shows the flow direction of the cutting liquid.

[0027] In this embodiment, the liquid extractor 5 is an electric pump. Of course, various devices such as pneumatic pumps and hydraulic pumps ca...

Embodiment 2

[0031] This embodiment provides another cutting fluid supply device, its structure is as follows figure 2 As shown, the cutting chamber 2 is provided with a liquid outlet 7, the liquid outlet 7 is located at the lowest point of the cutting chamber 2, and the lower part of the side wall of the liquid storage tank 1 is provided with a liquid inlet 8, and the position of the liquid inlet 8 is at the position of the liquid storage The position below the liquid surface of the cutting fluid in the tank 1, and the liquid inlet 8 is located below the liquid outlet 7. One end of the connector 6 is connected to the liquid outlet 7 , and the other end is connected to the liquid inlet 8 . In this embodiment, the connector 6 is a pipeline.

Embodiment 3

[0033] This embodiment provides a cutting fluid supply method, which can be realized by using the cutting fluid supply device in Embodiment 1 or Embodiment 2, and at least includes the following steps:

[0034] The liquid extractor 5 is used to extract the cutting fluid from the liquid storage tank 1 and supply it to the cutting assembly in the cutting chamber 2 ;

[0035] The cutting fluid in the cutting chamber 2 is returned to the fluid storage tank 1 through the connector 6 . Specifically, the cutting fluid flows back to below the level of the cutting fluid in the storage tank 1 .

[0036] In the cutting fluid supply device and method provided by the present invention, the cutting fluid flows through the liquid outlet 7 at the lowest point of the cutting chamber 2 to the liquid storage tank 1 through the connector 6, and the foam in the cutting fluid is connected due to the buoyancy rise. The cutting fluid in the device 6 is blocked in the cutting chamber, preventing the ...

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PUM

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Abstract

The invention discloses a cutting solution supply device which comprises a cutting bin, a solution storage tank, a solution extractor and a communicating vessel. The solution extractor supplies a cutting solution in the solution storage tank to a cutting assembly in the cutting bin. One end of the communicating vessel is connected with the cutting bin, and the end opening of the communicating vessel is located below the solution level of the cutting solution in the cutting bin; the other end of the communicating vessel is connected with the solution storage tank, and the end opening is locatedbelow the solution level of the cutting solution in the solution storage tank. The invention further discloses a cutting solution supply method implemented by means of the cutting solution supply device. The method comprises the steps of extracting the cutting solution from the solution storage tank by means of the solution extractor and supplying the cutting solution to the cutting assembly in the cutting bin; and enabling the cutting solution in the cutting bin to flow back into the solution storage tank through the communicating vessel. The cutting solution at the lower portion in the cutting bin is made to flow back into the solution storage tank by means of the communicating vessel, foams float on the solution level of the cutting solution, cutting foams in the cutting bin are effectively prevented from entering the solution storage tank, and meanwhile the phenomenon that due to air involving and collision, extra foams are generated when the cutting solution falls into the solution storage tank is avoided.

Description

technical field [0001] The invention belongs to the technical field of single crystal growth technology, and in particular relates to a supply device for supplying cutting fluid when silicon rods are sliced, and also relates to a cutting fluid supply method using the supply device. Background technique [0002] With the rapid development of the global economy, human demand for energy continues to grow, but fossil fuels such as coal, oil, and natural gas are gradually being exhausted. As a green energy, solar energy is being more and more accepted and applied by human beings, and it has been paid more and more attention by countries all over the world and has been vigorously developed. As the upstream product of solar cells, silicon wafers directly affect the product quality and cost of the battery side. Therefore, it is of great value and significance to improve technical measures, improve the quality of silicon wafers, and reduce the cost of silicon wafers. [0003] At pr...

Claims

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Application Information

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IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/007B28D5/042
Inventor 成路管辉胥鑫
Owner LONGI GREEN ENERGY TECH CO LTD