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Method for monitoring wafer defects by defect detection machine

A defect detection and detection machine technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as photoresist damage, low voltage and current, and increased labor costs, so as to avoid photoresist damage The effect of risk reduction, error reduction and labor cost reduction

Active Publication Date: 2022-02-01
SHANGHAI HUALI INTEGRATED CIRCUIT CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the photoresist is sensitive to the electron beam emitted by the defect detection machine, if the defect detection machine uses a high-voltage current flow method to detect defects, it will cause damage to the photoresist. Therefore, the defect detection of wafers with photoresist requires a special The detection program, the voltage and current of the program is relatively low
At present, in the actual operation process, it is necessary to manually judge the state of the wafer (whether there is photoresist on the surface) and then select the corresponding program. increase labor costs

Method used

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Embodiment Construction

[0016] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] In order to accurately select a defect detection program during the wafer defect detection process, avoid photoresist damage caused by defect detection from affecting subsequent processes, and reduce labor costs. In one embodiment of the present invention, a method for detecting wafer defects by a defect detection machine is provided. For details, please refer to figure 1 , figure 1 It is a flowchart of a method for detecting wafer defects by a defect inspection machine according to an embodiment of the pr...

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Abstract

The invention relates to a method for a defect detection machine to monitor wafer defects, and relates to a semiconductor integrated circuit defect detection technology. Absorbance selects the defect detection program of the defect detection machine to reduce the error of manually judging the surface condition of the wafer, avoid the risk of damage to the resistance of the wafer with photoresist during defect detection, and reduce labor costs.

Description

technical field [0001] The invention relates to semiconductor integrated circuit defect detection technology, in particular to a method for detecting wafer defects by a defect detection machine. Background technique [0002] In the field of semiconductor integrated circuit manufacturing technology, with the increasing integration of semiconductor integrated circuits and the development of semiconductor technology, the requirements for the performance of semiconductor devices are getting higher and higher, so the requirements for defect detection in the semiconductor manufacturing process are also increasing. come higher. [0003] Photolithography is a common process in the manufacturing process of semiconductor integrated circuits, so photoresist is a common material in the manufacturing process of semiconductor integrated circuits. In the semiconductor integrated circuit manufacturing process, there will be some typical defects after lithography, such as bridging (bridge),...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L22/12
Inventor 张兴棣范荣伟王恺
Owner SHANGHAI HUALI INTEGRATED CIRCUIT CORP