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Millimeter wave broadband miniaturized chip

A millimeter wave and chip technology, applied in the field of width, can solve the problem that the method of multi-chip assembly cannot meet the requirements and other problems

Pending Publication Date: 2019-12-20
南京嵩枫电子科技有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the improvement of integration and frequency of phased array systems, the traditional multi-chip assembly method can no longer meet the requirements, and there is an urgent need to develop highly integrated multi-function chips to replace traditional multi-chip functions with one chip

Method used

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  • Millimeter wave broadband miniaturized chip
  • Millimeter wave broadband miniaturized chip

Examples

Experimental program
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Effect test

Embodiment 1

[0022] Such as figure 1 As shown, a millimeter-wave broadband miniaturized chip includes a chip main board and a plurality of phase shifters and multiple sets of amplifiers arranged on the chip main board. The groups of amplifiers are connected by switches, and each group of amplifiers is 2, the signal output of one amplifier is connected to the signal input of the phase shifter, and the signal output of the phase shifter is connected to the signal input of another amplifier end.

[0023] The purpose of integrating the phase shifter and multiple sets of amplifiers on a chip motherboard is to make its structure more compact, and the purpose of setting multiple phase shifters and multiple sets of amplifiers at the same time is to realize the multi-channelization of the chip, and the chip model of the amplifier is RXO509.

Embodiment 2

[0025] Such as figure 2 As shown, in this embodiment, on the basis of Embodiment 1, the phase shifter includes a data interface P1, a data interface P2, a data interface P3 and a data interface P4, and one end of the data interface P1 is connected to one end of the inductor L1, The other end of the inductor L1 is connected to the data interface P3, the data interface P2 is connected to one end of the inductor L3, the other end of the inductor L3 is connected to the data structure P4, and the data interface P1 is connected to the A capacitor C2 and a capacitor C3 are connected in parallel between the data interfaces P3.

[0026] The use of capacitors and inductors to replace the lange coupler in the existing chip is to further reduce the area of ​​the controller circuit and make the overall structure of the chip more compact.

Embodiment 3

[0028] In this embodiment, on the basis of Embodiment 1, there are four phase shifters, and the number of amplifiers matches the number of groups of phase shifters.

[0029] The number of phase shifters is set to 4, and the number of corresponding amplifier groups is also 4, which is for the convenience of use.

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Abstract

The invention discloses a millimeter wave broadband miniaturized chip. The chip comprises a chip main board, and a plurality of phase shifters and a plurality of groups of amplifiers which are arranged on the chip main board, wherein the plurality of phase shifters are connected in series through wires, the phase shifters are connected with each group of amplifiers through switches, the number ofeach group of amplifiers is two, the signal output end of one amplifier is connected with the signal input end of the phase shifter, and the signal output end of the phase shifter is connected with the signal input end of the other amplifier. The phase shifter and the plurality of amplifiers are integrated on the same chip mainboard, so that the structure of the chip main board is more compact, and the plurality of phase shifters and the plurality of amplifiers are arranged at the same time, so that the multi-channel performance of the chip is realized.

Description

technical field [0001] The present invention relates to the technical field of width, in particular to a millimeter-wave broadband miniaturized chip. Background technique [0002] In a phased array system, the core is the TR component, and the core of the TR component is the chip. With the improvement of integration and frequency of phased array systems, the traditional multi-chip assembly method can no longer meet the requirements. There is an urgent need to develop highly integrated multi-function chips to replace traditional multi-chip functions with one chip. In addition, with the development of the system, the demand for broadband is also increasing. The first thing that needs to be solved is the problem of broadbanding the chip. [0003] Therefore, a chip that can realize broadband and high integration is in urgent need of research. Contents of the invention [0004] In order to solve the problems existing in the prior art, the present invention provides a millimet...

Claims

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Application Information

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IPC IPC(8): G06F15/78G06F15/17H04B1/40
CPCG06F15/7842G06F15/17H04B1/40
Inventor 袁野
Owner 南京嵩枫电子科技有限公司
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