Multi-input multi-output frequency domain impedance modeling method for modular multilevel converter

A modular multi-level, frequency-domain impedance technology, applied in the direction of instruments, electrical digital data processing, special data processing applications, etc., can solve the problem of not enough to consider the full coupling of the phase sequence

Active Publication Date: 2019-12-20
SHANGHAI JIAO TONG UNIV
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Problems solved by technology

In the past research, most researchers simplified the three-phase model of the modular multilevel converter into a single-phase model in order to simplify the model, which is not enough to consider all the coupling between phase sequences

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  • Multi-input multi-output frequency domain impedance modeling method for modular multilevel converter
  • Multi-input multi-output frequency domain impedance modeling method for modular multilevel converter
  • Multi-input multi-output frequency domain impedance modeling method for modular multilevel converter

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Embodiment Construction

[0078] The embodiments of the present invention will be described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention. Detailed implementation modes and specific operation procedures are given, but the protection scope of the present invention is not limited to the following implementations. example.

[0079] figure 1 Shown is a schematic structural diagram of a modular multilevel converter topology according to an embodiment of the present invention, figure 2 Shown is a schematic flow chart of a multi-input multi-output frequency domain impedance modeling method of a modular multilevel converter according to an embodiment of the present invention.

[0080] Please refer to figure 1 , figure 2 The multi-input multi-output frequency domain impedance modeling method of the modular multilevel converter of this embodiment includes the following steps:

[0081] S11: Establish a time-domain nonlinear three-phase model of the ...

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Abstract

The invention discloses a multi-input multi-output frequency domain impedance modeling method for a modular multilevel converter. The multi-input multi-output frequency domain impedance modeling method comprises the following steps: establishing a time domain nonlinear three-phase model of the modular multilevel converter; linearizing the time domain nonlinear three-phase model to obtain a time domain linear three-phase model; calculating each harmonic value corresponding to the steady-state working point in the time domain in the frequency domain; performing harmonic expansion on the linear three-phase model in the frequency domain based on the harmonic state space to obtain a linear three-phase harmonic state space model; expanding symmetric transformation in the harmonic space, and converting the linear three-phase harmonic state space model into a positive and negative sequence harmonic state space model; determining strong coupling frequency, and extracting positive and negative sequence components of voltage and current at the alternating current port from the positive and negative sequence harmonic state space model; and based on the positive and negative sequence componentscorresponding to the outlet voltage and current, linearly solving to obtain a multi-input multi-output frequency domain impedance model. According to the invention, internal harmonic coupling and positive and negative sequence coupling are considered, and the multi-input multi-output frequency domain impedance modeling method is more accurate.

Description

Technical field [0001] The present invention relates to the technical field of modular multilevel converters, in particular to a method for modeling multi-input multi-output frequency domain impedance of modular multilevel converters. Background technique [0002] With the rapid development of large-scale wind farms, the demand for modular multi-level converter high voltage direct current transmission (MMC-HVDC) solutions has increased significantly in recent years. Compared with the traditional DC transmission based on two-level voltage source converter (VSC-HVDC), MMC-HVDC has many advantages, such as modularity, high efficiency and lower loss. However, the unique multi-frequency response characteristics of the modular multi-level converter will cause it to produce multiple harmonic coupling in a wide frequency range, which can easily lead to unstable phenomena between the wind farm and MMC-HVDC. Oscillation etc. Therefore, it is very important to establish an accurate modula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 吕敬宗皓翔蔡旭
Owner SHANGHAI JIAO TONG UNIV
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