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Silicon microphone

A silicon microphone and substrate technology, applied in the field of micro-electromechanical, can solve the problems of large air volume in the front chamber, lower resonant frequency, lower signal-to-noise ratio of silicon microphones, etc., to improve sensitivity and signal-to-noise ratio, increase air volume, improve The effect of frequency response performance

Pending Publication Date: 2019-12-27
MEMSENSING MICROSYST SUZHOU CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The air volume in the back chamber of the existing silicon microphone is small, and it is more difficult to push the movement of the silicon diaphragm, resulting in a decrease in the sensitivity of the MEMS sensor, which in turn leads to a decrease in the signal-to-noise ratio of the silicon microphone, and the air volume in the front chamber is large, and the resonance frequency will decrease. , affecting the frequency response performance of silicon microphones

Method used

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Embodiment Construction

[0026] The specific implementation of the silicon microphone provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0027] figure 1 It is a structural schematic diagram of the first embodiment of the silicon microphone of the present invention. see figure 1 As shown, the silicon microphone includes a housing 1 , a substrate 2 and an acoustic component 3 .

[0028] The casing 1 has a sound inlet 10 . The sound inlet 10 runs through the housing 1 , that is, the sound inlet 10 is a through hole. The external sound air flows into the silicon microphone through the sound inlet hole 10 .

[0029] The base plate 2 and the housing 1 form an accommodating chamber 100 . In this specific embodiment, the substrate 2 is in a concave configuration, the housing 1 is a cover plate, and the housing 1 is covered on the substrate 2 to form the accommodating cavity 100 . In the second specific implementation manner of the present i...

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Abstract

The invention provides a silicon microphone, which comprises a shell, and is characterized in that the shell is provided with a sound inlet hole; the base plate and the shell form a accommodating cavity, the sound inlet hole is communicated with the accommodating cavity, one surface of the base plate is provided with a concave cavity, and the concave cavity is provided with an opening; acoustic assembly, the piston is positioned in the accommodating cavity; the acoustic assembly is arranged in the cavity and arranged on the surface of the substrate, the acoustic assembly comprises an MEMS sensor, the MEMS sensor covers the opening, the cavity serves as an extended rear chamber of the MEMS sensor, and the area between the sound inlet hole and the MEMS sensor serves as a front chamber of theMEMS sensor. The silicon microphone has the advantages that the concave cavity is formed in the substrate, the volume of the rear chamber of the MEMS sensor is enlarged, that is, the air volume of the rear chamber is increased, and sound waves entering from the sound inlet hole more easily push the vibrating diaphragm of the MEMS sensor to move, so that the sensitivity and the signal-to-noise ratio of the silicon microphone are improved, Meanwhile, the frequency response performance of the silicon microphone can also be improved.

Description

technical field [0001] The invention relates to the field of micro-electromechanical (MEMS) technology, in particular to a silicon microphone. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It uses advanced semiconductor manufacturing technology to realize batch manufacturing of sensors, drivers and other devices. Compared with the corresponding traditional devices , MEMS devices have very obvious advantages in terms of volume, power consumption, weight and price. In the market, the main application examples of MEMS devices include pressure sensors, accelerometers and silicon microphones. [0003] Silicon microphones, also known as MEMS microphones, are microphones based on MEMS technology. A MEMS microphone is composed of a MEMS sensor, an ASIC amplifier, an acoustic cavity, and a circuit board with an RF suppression circuit. The MEMS sensor chip i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04
Inventor 张永强唐行明梅嘉欣李刚
Owner MEMSENSING MICROSYST SUZHOU CHINA
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