Back plate, backlight module, display device and preparation method of back plate

A backplane and seed technology, applied in optics, nonlinear optics, instruments, etc., can solve problems such as affecting the shape of thick Cu, collapse of retaining walls, and reduced luminous performance of Mini-LEDs

Active Publication Date: 2019-12-31
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, due to the poor adhesion between the retaining wall and the Cu surface in the backplane used by Mini-LED, the edge of Cu will grow, causing the retaining wall to collapse, affecting the shape of thick Cu, and then affecting the shape of the backplane. performance, reducing the luminous performance of Mini-LED

Method used

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  • Back plate, backlight module, display device and preparation method of back plate
  • Back plate, backlight module, display device and preparation method of back plate
  • Back plate, backlight module, display device and preparation method of back plate

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Embodiment 1

[0051] refer to figure 1 , providing a backplane 10, comprising:

[0052] Substrate 11; seed layer 12, said seed layer 12 includes: a plurality of electrode seeds 121 arranged at intervals on said substrate; protective layer 13, said protective layer 13 is arranged between adjacent electrode seeds 121, and covers all The edge area of ​​the electron seed 121; the electrode block 14, each of the electrode blocks 14 is arranged on the electrode seed 121 between the adjacent protective layers 13, and is located on the side of the electrode seed 121 away from the substrate 11; the filling layer 15 , the filling layer 15 is filled between the electrode blocks 14; the leveling layer 16, the leveling layer 16 covers the filling layer 15 and one of the electrode blocks 14 away from the electrode seeds 121 side.

[0053] In the embodiment of the present invention, the substrate includes: a glass substrate; the material of the seed layer includes: metal copper.

[0054] Among them, the ...

Embodiment 2

[0074] refer to image 3 The second aspect of the present invention is to provide a backlight module, including the above-mentioned backplane 10 and a plurality of point light sources 20; the point light sources 20 are arranged on one side of the backplane; the point light sources include : the first electrode 21 and the second electrode 22 ; the first electrode 21 is connected to the first connection electrode 19 , and the second electrode 22 is connected to the second connection electrode 20 .

[0075] In the embodiment of the present invention, the point light source includes: a mini-LED, and the first electrode and the second electrode can be positive and negative respectively, and are used to connect a power source to supply power to the mini-LED.

[0076] A third aspect of the present invention is to provide a display device, including the above-mentioned backlight module.

[0077] In an embodiment of the present invention, the backplane includes: a substrate; a seed la...

Embodiment 3

[0079] refer to Figure 4 , the embodiment of the present invention provides a fourth aspect of the present invention to provide a method for preparing a backplane, using the backplane described in any one of the above methods, the method comprising:

[0080] Step 201 , providing a substrate 11 .

[0081] In an embodiment of the present invention, the substrate includes: a glass substrate.

[0082] Step 202 , preparing a seed layer 12 on the substrate 11 ; the seed layer includes: a plurality of electrode seeds 121 arranged at intervals.

[0083] Step 203, coating a protective material on the substrate and the side of the electrode seed facing away from the substrate, and patterning the protective material to obtain a protective layer 13, so that the protective layer is placed on the electrode between the seeds and cover the edge regions of the electron seeds.

[0084] In the embodiment of the present invention, the protection layer is a polymer of inorganic silicon nitride...

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Abstract

The invention provides a back plate, a backlight module, a display device and a preparation method of the back plate. The back plate comprises a substrate, a seed layer, protective layers, electrode blocks, filling layers, and leveling layers. The seed layer includes a plurality of electrode seeds which are arranged on the substrate at intervals. The protective layers are arranged between the adjacent electrode seeds and cover the edge areas of the electronic seeds. The electrode blocks are arranged on the electrode seeds between the adjacent protective layers at surfaces, away from the substrate, of the electrode seeds. The filling layers fill the space between the electrode blocks. The leveling layers cover sides, away from the electrode seeds of the filling layers and all electrode blocks. According to the embodiment of the invention, because of the protective layers at the edge areas of the electrode seeds, the edge areas of the electrode seeds do not grow to prevent the influenceon the shapes of the electrode blocks, so that the quality of the backboard is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a backplane, a backlight module, a display device and a preparation method for the backplane. Background technique [0002] LCD (Liquid Crystal Display) has obvious advantages over OLED (Organic Laser Display) in terms of cost and lifespan; it is almost equal in terms of color gamut, resolution, and power consumption; but it has obvious disadvantages in terms of contrast and motion image blur. If the contrast ratio and motion blur issues are resolved, the performance of LCD will be greatly improved, and it will be able to directly compete with OLED in all aspects of non-flexible applications. The problem of motion image blur can be solved by high refresh rate and low duty cycle, which makes the technology of significantly improving display contrast very important. [0003] In addition to being used as an independent display, Mini-LED (miniature light-emitting diode) can also be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357
CPCG02F1/133602G02F1/133603G02F1/133612
Inventor 宋晓欣刘文渠吕志军董立文崔钊孟德天王利波姚琪张锋
Owner BOE TECH GRP CO LTD
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