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Manufacturing method of circuit board components

A manufacturing method and circuit board technology, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve problems such as detachment and poor soldering of solder balls, and achieve the effect of reducing solder detachment and improving yield

Active Publication Date: 2021-04-20
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, solder balls may be detached due to internal stress such as poor soldering, thermal expansion and contraction, or other external stresses (that is, commonly known as dropballs).

Method used

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  • Manufacturing method of circuit board components
  • Manufacturing method of circuit board components
  • Manufacturing method of circuit board components

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Experimental program
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Effect test

Embodiment Construction

[0071] Figure 1A to Figure 1I is a schematic cross-sectional view of a manufacturing method of a circuit board component according to the first embodiment of the present invention. Figure 1D can be Figure 1A , Figure 1B or Figure 1C Enlarged view of middle region R1. Figure 1F can be Figure 1E Enlarged view of middle region R2. Figure 1H can be Figure 1G Enlarged view of middle region R3. Figure 1K can be Figure 1I or Figure 1J Enlarged view of middle region R4.

[0072] Firstly, it is described that the manufacturing method of the circuit board structure in this embodiment includes the following steps. First, please refer to Figure 1A and Figure 1D , providing a circuit substrate 110 . The circuit substrate 110 includes an insulating layer 120, circuit layers 130, 130', protection layers 140, 140', a plurality of solder balls, such as a plurality of first solder balls 150 and a plurality of second solder balls 160. The circuit layer 130 is located ...

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Abstract

The invention provides a circuit board component, which includes an insulation layer, a circuit layer, a protection layer, a plurality of solder balls and a dielectric layer. The wiring layer is on the insulating layer. The protective layer is located on the circuit layer and has a plurality of openings exposing the circuit layer. A plurality of solder balls are disposed on the passivation layer and embedded in corresponding openings. A dielectric layer is located between the solder balls and the protective layer. In addition, a method for manufacturing circuit board components is proposed.

Description

technical field [0001] The invention relates to an electronic component and a manufacturing method thereof, in particular to a circuit board component and a manufacturing method thereof. Background technique [0002] Solder balls are often used to electrically connect with other electronic components on a general circuit board. However, solder balls may be detached due to internal stresses such as poor soldering, thermal expansion and contraction, or other external stresses (ie, commonly known as dropballs). Therefore, how to reduce the possibility of detachment of the solder balls on the circuit board has become an urgent problem to be solved. Contents of the invention [0003] The invention provides a circuit board component and a manufacturing method thereof, which have better yield. [0004] The manufacturing method of the circuit board component of the present invention The manufacturing method includes the following steps. Provide circuit boards. The circuit subs...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/13H01L23/492H01L21/48
CPCH01L21/4821H01L23/13H01L23/492H01L2224/18
Inventor 谢育忠简俊贤陈裕华
Owner UNIMICRON TECH CORP
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