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Package structure

A technology of packaging structure and contact structure, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of electromagnetic shielding effect to be improved, and achieve performance improvement, integrity assurance, and shielding effect. Effect

Active Publication Date: 2021-09-24
NANTONG TONGFU MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] An existing electromagnetic shielding solution is mainly to set a magnetic field shielding layer on the semiconductor packaging structure to shield the electromagnetic interference between chips, but the effect of the existing electromagnetic shielding still needs to be improved

Method used

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Embodiment Construction

[0030] As mentioned in the background, the effect of existing electromagnetic shielding still needs to be improved.

[0031] The study found that the existing magnetic field shielding layer is generally formed by sputtering process. Since the thickness of the semiconductor package structure is generally thick, and the semiconductor package structure is generally rectangular, the semiconductor package structure has multiple corners and the side wall is relatively steep. When the magnetic field shielding layer covering the semiconductor package structure is formed by sputtering, the thickness of the formed magnetic field shielding layer is likely to be uneven, and the edge of the semiconductor package structure may not be covered, thus making it difficult to guarantee the shielding effect of the magnetic field shielding layer.

[0032] To this end, the present invention provides a packaging structure and its forming method. After the functional surfaces of several semiconductor c...

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Abstract

A packaging structure, the plastic sealing layer has several semiconductor chips and electronic components that do not need to be shielded on one side of each semiconductor chip; the first shielding layer and the second shielding layer are located between the semiconductor chip and the plastic sealing layer, and the The first shielding layer covers the non-functional surface and the sidewall surface of the semiconductor chip, and the second shielding layer is located between the first shielding layer and the plastic encapsulation layer and completely covers the non-functional surface and the sidewall of the semiconductor chip. The surface of the first shielding layer, the second shielding layer can cover the uneven thickness and poor edge coverage of the first shielding layer, so that the overall shielding formed by the first shielding layer and the second shielding layer The layers are intact, improving the shielding effect. Moreover, the invention realizes the integrated packaging of the semiconductor chip and the electronic components that do not need to be shielded, and improves the performance of the packaging structure.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a packaging structure with electromagnetic shielding. Background technique [0002] The rapid development of a new generation of electronic products has promoted the development of integrated circuit packaging in the direction of high density, high frequency, miniaturization, and high integration, and high-frequency chips often generate strong electromagnetic waves, which cause undesirable effects on the inside and outside of the package and the chip. In addition, the density of electronic components is getting higher and higher, and the distance of transmission lines is getting closer and closer, which makes the problem of electromagnetic interference from inside and outside the integrated circuit package more and more serious, and at the same time will reduce the quality and life of integrated circuits. [0003] In electronic equipment and electronic products, electro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552H01L23/31H01L21/56
CPCH01L23/552H01L23/3107H01L21/561H01L21/568H01L2224/96H01L2924/3025
Inventor 石磊
Owner NANTONG TONGFU MICROELECTRONICS CO LTD