Soft board structure, TO optical module and optical transmission device

Abstract

The invention discloses a soft board structure, a TO optical module and an optical transmission device, wherein the soft board structure comprises a first metal layer, a substrate and a second metal layer, which are stacked in sequence from bottom to top; the first metal layer is configured to provide a grounding plane; a high-speed signal link is formed on the second metal layer; a first high-speed signal through hole and a second high-speed signal through hole are formed on the soft board structure; a first through hole and a second through hole are respectively formed on the soft board structure and the position near the first high-speed signal through hole and the second high-speed signal through hole; and metal welding materials connected with the first metal layer are arranged on theside walls of the first through hole and the second through hole. When the soft board structure is assembled on the TO optical device, conductive materials connected to a tube socket and the metal welding materials are filled in the first through hole and the second through hole. The soft board structure, the TO optical module and the optical transmission device in the invention can be suitable for transmitting high-rate signals, and simultaneously, have a simple manufacturing process and relatively low manufacturing cost.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a soft board structure, a TO optical module and an optical transmission device. Background technique [0002] Driven by the current demand for 5G wireless fronthaul of the fifth-generation communication network and ultra-large broadband data centers, the speed requirements for its core component optical transceiver modules are getting higher and higher. In terms of 5G wireless fronthaul, 25Gbps optical modules have become the mainstream, and the market demand is huge. In addition, high-speed optical modules are more widely used in data centers. [0003] Commonly used packages for optical modules include TO packages and Box packages. TO package (such as figure 1 ) has a simple process and low cost, and was the mainstream packaging form of optical modules in the past, but it cannot be applied in high-speed and ultra-high-speed optical modules. Box packaging adopts...

AI Technical Summary

Problems solved by technology

[0005] The interface between the FPC flexible board and the TO optical device is the most important cause of the deterioration of ultra-high-speed signal transmission, mainly manifested in the fact that the transmission mode of the high-speed line on the TO optical device and the FPC soft The design of the line can meet the standard impedance requirements, but the conversion of the transmission mode at the interface often brings about a resonance problem with devastating effects, which is the key technical bottleneck that the TO package has not been able to apply to high-speed and super-speed. The probability of occurrence is very small when applying

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