Manufacturing method of nano structure

A nanostructure and fabrication method technology, applied in the field of nanostructure fabrication, can solve the problems of nanostructure damage, electron beam resist being difficult to be stripped off, etc.
CN110737170APending Publication Date: 2020-01-31SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
Publication Date
2020-01-31

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Abstract

The invention relates to a manufacturing method of a nano structure. The method comprises the steps that a layout which is provided with an exposed area and a non-exposed area is drawn, and an auxiliary exposure area is set in the non-exposed area; a positive electron resist is used to form a resist layer on a substrate; and the resist layer is exposed according to the layout, and then developed to acquire a patterned resist layer. In the step of the exposure process, the exposure dose of the auxiliary exposure area is smaller than the exposure dose of the exposed area, so that a groove is formed in the area of the resist layer corresponding to the auxiliary exposure area. A metal layer is formed on the patterned resist layer to acquire a laminate. The laminate is cleaned with a stripper reagent to remove the resist layer to acquire the nano structure. According to the manufacturing method of the nano structure, a pattern is easily peeled, and the acquired pattern is complete.
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Description

technical field

[0001] The invention relates to the field of making nanostructures, in particular to a method for making nanostructures. Background technique

[0002] Nanostructures are widely used, but the preparation process of nanostructures is relatively complicated. The flexibility and high resolution of electron beam exposure direct writing make it possible to process fine structures smaller than 10 nanometers. Therefore, electron beam lithography equipment is often used to prepare nanostructures. We formed the nanostructures by spin-coating an e-beam resist on the substrate and after e-beam exposure. After the metal film is deposited, it is peeled off to transfer the nanostructure to the metal film. However, for nanoscale structures, especially closed patterns, the electron beam resist is difficult to be stripped off, and improper handling can easily cause damage to nanostructures. Contents of the invention

[0003] Based on this, it is necessary to provide a me...

Claims

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