Method for solving circuit exposure of super-long product

Abstract

The invention provides a method for solving circuit exposure of a super-long product and relates to the technical field of circuit board processing. The super-long product line exposure solution method comprises steps that S1, line patterns of a super-long product are designed on six glass substrates in a segmented manner, the glass substrates are numbered according to the line patterns in sequence as 1-6 for distinguishing, and the glass substrates are sequentially placed on a rotatable turntable platform in an exposure machine; and S2, when the product is subjected to exposure operation, theglass substrate with the number of 1 is located at the exposure position, and an identification Senser on the exposure machine completes alignment with an identification alignment mark on the glass substrate by capturing carrying holes on two sides of a tape winding type base material. The super-long product line exposure solution method is advantaged in that by designing the alignment marks on the glass substrates, alignment precision of the connection position is improved, the yield is improved, moreover, technical support is provided for designing a finer circuit, fine development of products is facilitated, and the method is high in equipment utilization rate, high in product production efficiency, high in yield and the like.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a solution to the circuit exposure of ultra-long products. Background technique [0002] With the application of circuit board products in medical, wearable devices, military and other fields, ultra-long single PCS products have become a market demand. At present, the most widely used technology in COF products is the exposure of single small PCS products. After the circuit typesetting, it is designed on the glass negative film. When the product is produced, the tape-type substrate is punched first, and then a layer of photoresist is coated. When the product is exposed, the non-circuit part of the glass negative film is a light-transmitting area. These light-transmitting parts After receiving the exposure energy, the photoresist produces a decomposition reaction, so that the circuit pattern on the glass negative is transferred to the photoresist to complete the e...

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Problems solved by technology

[0003] In the prior art, due to the limitations of the exposure machine platform, the uniformity of exposure energy, and the size of the glass film, it is currently impossible to increase the size of the dry plate to realize the exposure operation of a super-long single PCS, and it can only be realized by manually replacing the dry plate for re-alignment. The continuity of the line, due to the large alignment tolerance, the line at the butt joint of the product glass film needs to be designed with a large pitch to achieve line alignment during product design, so it affects the development of the line to refinement, and the glass film is replaced manually It takes a long time and the production efficiency is low; if the length of the product is large, the number of glass negatives required is large, and it is easy to use the wrong glass negative in the process of manual replacement, resulting in defects; it is easy to bring dust into the process of manual replacement of glass negatives, resulting in poor exposure

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