Method for planning laser scanning path of thin-walled part and 3D printing method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TSC LASER TECH DEV BEIJING CO LTD
- Publication Date
- 2020-02-04
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of additive manufacturing, in particular to a laser scanning path planning method and a 3D printing method for thin-walled parts. Background technique
[0002] Thin-walled parts are increasingly widely used in various industrial sectors because of their light weight, material saving, and compact structure. However, the processing of thin-walled parts is a difficult problem in turning because of poor rigidity and weak strength of thin-walled parts. , It is very easy to deform during processing, which increases the shape and position error of the part, and it is difficult to guarantee the processing quality of the part. Therefore, 3D printing to manufacture thin-walled parts is constantly being promoted. For thin-walled parts, especially large thin-walled parts, when 3D printing is used to manufacture part blanks, due to the small thickness of the parts themselves, it is easy to cause problems such as excessi...