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Laser hole processing system and method with processing and real-time detection capability

A real-time detection and processing system technology, applied in the field of micro-nano detection, can solve the problems of complex structure of detection equipment and high detection cost, and achieve the effect of compact and simple structure, improved signal-to-noise ratio, and simple structure

Active Publication Date: 2020-02-04
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0007] In order to overcome the problems of complex structure of detection equipment and high detection cost in the existing non-contact real-time detection method of hole depth in ultrafast laser micro-nano processing, the present invention provides a laser hole processing system and method with both processing and real-time detection capabilities

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  • Laser hole processing system and method with processing and real-time detection capability
  • Laser hole processing system and method with processing and real-time detection capability

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Embodiment

[0041] see figure 1 , a laser hole processing system with both processing and real-time detection capabilities, including a semiconductor laser 1, a beam collimation unit 2, a polarizer 3, a quarter wave plate 4, a dichroic beam splitter 5, a data acquisition unit 7, Data processing unit 8 and laser processing equipment 9; It should be noted that: laser processing equipment 8 adopts existing conventional laser processing equipment, and its main components include laser, laser focusing unit, parameter adjustment and motion control unit. In addition, the laser here may be a continuous laser, a pulse laser or an ultrashort pulse laser. In this embodiment, an ultrashort pulse laser is selected. The beam collimation unit 2 here is a fast and slow axis collimation system;

[0042] A beam collimation unit 2, a polarizer 3, a quarter-wave plate 4, a dichroic beam splitter 5, and a workpiece 6 are sequentially arranged on the probe beam emitted by the semiconductor laser 1; the polar...

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Abstract

The invention provides a laser hole processing system and method with processing and real-time detection capability. The problems that in an existing ultra-fast laser micro-nano processing hole depthnon-contact real-time detection mode, detection equipment is complex in structure and the detection cost is high are solved. The system comprises a semiconductor laser device, a beam collimation unit,a polarizer, a quarter wave plate, a dichroic beam splitter, a data acquisition unit, a data processing unit and a laser processing device. The semiconductor laser device emits lasers, and the lightwhich passes through the beam collimation unit and the polarizer and is emitted to the dichroic beam splitter and the laser processing device is emitted to a processed part together; and semiconductorlaser reflected light is returned into a cavity of the semiconductor laser device along the original optical path, a change curve of relative intensity change signals of the semiconductor laser device and processing time is obtained, and the depth of a laser processed hole can be calculated in real time through the data processing unit.

Description

technical field [0001] The invention belongs to the technical field of micro-nano detection, and relates to a laser hole processing system with both processing and real-time detection capabilities. Background technique [0002] Ultra-short laser pulse micro-hole processing technology is a new type of special processing technology. Compared with traditional electrical drilling and mechanical drilling methods, it has fast drilling speed and high efficiency; it can obtain smaller hole diameter and higher depth. Diameter ratio; not affected by materials and their shapes, laser drilling can be performed on various materials and parts with complex shapes; it can realize group hole processing with high density and high positioning accuracy. [0003] At present, in my country, there are problems of wall thickness exceeding tolerance and quality instability in the process of femtosecond laser machining of air film holes of aero-engine turbine blades. Direct processing of the air film...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/70G01B11/22
CPCB23K26/382B23K26/702G01B11/22
Inventor 王向林刘晖
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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